Brewer Science, Inc.

Sun Chemical Corporation

Sensient Colors Incorporated

Wenbin Hong

Tony D Flaim

Rama Puligadda

Dongshun Bai

Sunil K Pillalamarri

Mihaela Madaras

Tingji Tang

Gu Xu

Xing-Fu Zhong

Kimberly Yess

Tantiboro Ouattara

Ramachandran K Trichur

Susan Bailey

Heping Wang

Peter John Lyon

Aqueous inkjet ink compositions, methods of preparing the inkjet ink compositions, inkjet ink cartridges containing the aqueous inkjet ink composition, methods of filling a print cartridge with the aqueous inkjet ink composition, and methods of printing an image on a substrate using the inkjet ink composition are disclosed.

Aqueous inkjet ink compositions

A dispersion comprising a pigment, a polymer comprising a carboxyl group, a crosslinking agent capable of undergoing a crosslinking reaction with the carboxyl group, an inhibition agent comprising a tertiary amine, and a liquid carrier, wherein at least one of the mean particle size and the viscosity of the dispersion increases by less than 20% over about three months in sealed storage at ambient temperature, as determined by accelerated shelf life testing.

Self-crosslinking dispersions, and methods for making and using the same

New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Development of high-viscosity bonding layer through in-situ polymer chain extension

New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.

Acid-etch resistant, protective coatings

New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Cyclic olefin compositions for temporary wafer bonding

The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).

Fluorinated polyimides with fluorene cardo structure as optical materials that have low absolute thermo-optic coefficients

New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

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Rolla, MO, United States of America

Wenbin Hong