Industrial Technology Research Institute

Epistar Corporation

Industrial Technology Institute

Tyntek Corporation

Wen-Yung Yeh

Hsi-Hsuan Yen

Jui-Ying Lin

Ming-Te Lin

Yu-Chen Yu

Chia-Hsin Chao

Sheng-Pan Huang

Ming-Hsien Wu

Mu-Tao Chu

Ming-Yao Lin

Chen-Kun Chen

Hsuan-Yu Lin

Han-Tsung Hsueh

Chun-Ting Liu

Kuang-Yu Tai

Hsin-Chu Chen

Sheng-Chieh Tai

Wen-Hong Liu

Chia-Chang Kuo

Chih-Ming Lai

Cheng-Chung Lee

Wen-Yih Liao

Su-Tsai Lu

Je-Ping Hu

Yi-Ming Chang

Yi-Jen Chan

Chen-Yang Huang

Jung-Tsung Hsu

Hung-Hsien Ko

Chun-Feng Lai

Jim-Yong Chi

Cheng-Ta Pan

Tse-Peng Chen

Chen-Peng Hsu

Kuo-Tung Tiao

Rong Xuan

Jenq-Dar Tsay

Chao-Feng Sung

Chih-Hao Hsu

Sheng-Feng Chung

Bao-Shun Yau

Chien-Jen Sun

Chang-Ying Chen

Cheng-Yen Tsai

Kun-Fong Lin

I-Hung Chiang

Ying-Chien Chu

Jih-Fu Wang

Yu-Hung Chuang

Chang-Cheng Chuo

Chia-Ling Li

Ta-Wei Chien

Yu-Chun Lin

His-Hsuan Yen

Ting-Chi Lee

Yuan-Shan Chung

Chih-Shu Huang

Kuo Jui Huang

A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.

Stress measuring device and stress measuring method

A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.

Stretchable electronics generating apparatus and layout method thereof

An illumination device includes a substrate, a light emitting structure, a sealant, and a laminating board is provided. The light emitting structure includes a first electrode layer, a light emitting layer and a second electrode layer stacked on the substrate sequentially. The sealant covers the light emitting structure. The laminating board is attached to the substrate. The sealant is located between the laminating board and the substrate. The laminating board includes a carrier body, a metal layer and a plurality of pads. The metal layer is exposed at a first surface of the carrier body, is in contact with the sealant and shields an area of the light emitting layer of the light emitting structure. The pads are exposed at the first surface of the carrier body and electrically connected to the first electrode layer and the second electrode layer. The metal layer is electrically isolated from the pads.

Illumination device and method of fabricating an illumination device

A light-emitting device is introduced herein. The light-emitting device comprises a first light-generating active layer and a second light-generating active layer stacked in a vertical direction on a substrate wherein the first light-generating active layer and the second light-generating active layer emit light having substantially the same wavelength, and wherein the substrate, the first light-generating active layer, and the second light-generating active layer are formed together in a chip.

Light-emitting device

A light-emitting assembly includes a first substrate, a first electrode layer, a light-emitting layer, a second electrode layer, a second substrate, a first conductive member and a second conductive member. The first electrode layer, the light-emitting layer and the second electrode layer are sequentially disposed on the first substrate. An area of the second electrode layer is entirely located within an area of the light emitting layer. The second electrode layer is located between the second substrate and the light-emitting layer. The first and second conductive members are disposed between the first and second substrates. The first electrode layer is electrically connected to a first circuit on the second substrate through the first conductive member. The second electrode layer is electrically connected to a second circuit on the second substrate through the second conductive member. The second conductive member is located within the area of the second electrode layer.

Light-emitting assembly

An organic light-emitting device includes a first substrate, a light-emitting structure layer, a first electrode layer, a second electrode layer, a second substrate, first conduction members, a second conduction member and protection structures. The light-emitting structure layer is disposed on the first substrate. The first electrode layer is disposed on the light-emitting structure layer and includes pad-like patterns. The second electrode layer is disposed between the light-emitting structure layer and the first substrate. The second substrate is adhered on the first electrode layer and includes a first circuit and a second circuit. The first circuit includes a continuous pattern and contact portions. The first conduction members are connected between the first circuit and the first electrode layer. The second conduction member is connected between the second circuit and the second electrode layer. The protection structures respectively form open circuits or close circuits between the contact portions and the continuous pattern.

Organic light-emitting device

A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.

Transfer-bonding method for the light emitting device and light emitting device array

An organic light-emitting diode (OLED) apparatus includes at least one OLED illumination module, a driving unit, an optical sensing module, a control unit, and a storage unit. The driving unit is configured to adjust voltage applied to the OLED illumination module, so as to change a CCT of the OLED illumination module. The optical sensing module is configured to sense the light emitted by the OLED illumination module. The control unit is configured to receive a feedback signal from the optical sensing module so as to adjust a light intensity and the CCT of the OLED illumination module. The storage unit is configured to store photoelectric parameter data of the OLED illumination module. The control unit is configured to adjust the CCT and the light intensity of the OLED illumination module to target values according to the photoelectric parameter data.

Organic light-emitting diode apparatus

An organic light-emitting module including a light-transmissive substrate, a light extracting structure, a first electrode, an organic light-emitting stack, a second electrode, and a transparent carrying board is provided. The light-transmissive substrate has an index of refraction greater than 1.5 and has a first surface and a second surface opposite to the first surface. The light extracting structure is disposed at the first surface. The first electrode is disposed on the second surface of the light-transmissive substrate. The organic light-emitting stack is disposed on the first electrode. The second electrode is disposed on the organic light-emitting stack. The transparent carrying board is connected with the light extracting structure. A minimum distance between the light extracting structure and the transparent carrying board is less than or equal to 125 &#x3bc;m.

Organic light-emitting module

An alternating current (AC) light emitting device includes an AC light emitting diode (LED) module and a waveform modulation unit. The AC LED module includes at least two sets of micro-diodes. The waveform modulation unit coupled between the AC LED module and an AC voltage source modulates a waveform of the AC voltage source.

Alternating current light emitting device

A light-emitting system is introduced herein. The light-emitting system includes an insulating substrate and a plurality of light-emitting units electrically-connected on the insulating substrate. Each of the plurality of light-emitting units includes a plurality of light-emitting diodes arranged as a bridge rectifier. A first part of the plurality of light-emitting diodes emits light during positive half cycles of an AC power signal. A second part of the plurality of light-emitting diodes emits light during negative half cycles of the AC power signal. The third part of the plurality of light-emitting diodes comprising at least one light-emitting diode emits light during both the positive half cycles and the negative half cycles of the AC power signal, wherein the plurality of light-emitting units including the plurality of light-emitting diodes arranged as a bridge rectifier is formed together in a light-emitting chip.

Alternative current light-emitting systems

An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.

Illumination device

A photography and projection apparatus including a light emitting and sensing module and a projection lens is provided. The light emitting and sensing module has a light emitting and sensing area, and includes a light emitting unit array and a light sensing unit array. The light emitting unit array includes a plurality of light emitting units arranged in an array. The light emitting units are distributed in the light emitting and sensing area. The light emitting unit array is adapted to provide an image beam. The light sensing unit array includes a plurality of light sensing units arranged in an array. The light sensing units are distributed in the light emitting and sensing area. The projection lens is disposed on a transmission path of the image beam. A light emitting and sensing module is also provided.

Photography and projection apparatus and light emitting and sensing module

A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.

Light emitting element and fabricating method thereof

An illumination device including a light-emitting panel, a touch panel, and a control module is provided. The light-emitting panel includes a light-emitting layer configured to emit a light beam. The touch panel is overlaid on the light-emitting panel, and includes a first touch electrode. The control module is electrically connected to the light-emitting panel and the touch panel. The light-emitting layer further includes a light-emitting material, and the width of the light-emitting material is greater than half of the width of the first touch electrode.

Growing community of inventors

Hsinchu County, Taiwan

Wen-Yung Yeh