Au Optronics Corporation

Industrial Technology Research Institute

Wen-Wei Yang

Cheng-Chieh Chang

Pin-Miao Liu

Tsung-Tien Wu

Cheng-Yeh Tsai

Ho-Cheng Lee

Ssu-Pin Ma

Yi-Cheng Liu

Chen-Chang Chen

Shuw Guann Lin

Chen-Chung Kuo

Min Hung Shen

Chen-Chi Lin

Kuo-Lung Lo

Ting-Wei Guo

Fang-Cheng Yu

Tsung-Yi Lin

The display panel includes an array substrate, a light emitting diode and a first connection electrode. The array substrate includes a driving circuit layer. The light emitting diode is disposed on the array substrate. The light emitting diode includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The first connection electrode is electrically connected to the driving circuit layer and the first semiconductor layer. The first connection electrode wraps the light emitting layer such that a normal projection of the light emitting layer over the array substrate is within a normal projection of the first connection electrode over the array substrate.

Display panel and tiled display

A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.

Bi-directional optical module and transparent display apparatus using the same

A display panel and a pixel structure are provided. The pixel structure includes a substrate, a micro light emitting diode (micro LED or &#x3bc;LED), a sidewall structure, a filling layer, and a reflective layer. The substrate has a bearing surface, and the micro LED is disposed on the bearing surface directly or indirectly. The sidewall structure is disposed on the bearing surface and defines at least one accommodation cavity to accommodate the micro LED. The filling layer is filled in the accommodation cavity and surrounds the micro LED. The reflective layer covers a top surface of the filling layer and has a plurality of light-transmissible windows. The micro LED forms, in a vertical projection direction, a vertical projection region in an overlapping region on the reflective layer. Among the light-transmissible windows, those having longer distances to the vertical projection region have larger areas.

Display panel and pixel structure thereof

An LED panel including a substrate, multiple first pixels, multiple second pixels, multiple first protrusion structures and second protrusion structures is provided. The first pixels and second pixels each disposed in a display area of the substrate has at least one light emitting element. The second pixels are positioned on at least one display edge of the display area and positioned between the first pixels and a substrate edge. Each first protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding first pixel. Each second protrusion structure is positioned on the periphery of the at least one light emitting element of one corresponding second pixel. The orthogonal projection contour of each first protrusion structure on the substrate is different from that of each second protrusion structure on the substrate. A tiling display apparatus adopting the light emitting diode panel is also provided.

Light emitting diode panel and tiling display apparatus

A light emitting diode (LED) display panel includes a back plate and a pixel structure, which includes multiple pixels. Each pixel includes a reflector structure and two LEDs emitting light of a same color, all disposed on the back plate. The reflector structure of each pixel has a first reflective bank structure and a second reflective bank structure. The first reflective bank structure has a first bank opening. The second reflective bank structure has a second bank opening. The two LEDs are disposed within the first and second bank openings. The first bank opening has a first shape, and the second bank opening has a second shape, which is a mirror shape or a 180&#xb0; symmetrical shape of the first shape. For each of the pixels, the first shape is a polygonal shape, and at least two corners of the first shape have an included angle less than 90&#xb0;.

Pixel arrangement and reflector structure of LED display and method of forming same

A device substrate includes a receiving substrate, a micro light emitting element, a first wire, and a second wire is provided. The micro light emitting element is disposed on the receiving substrate. The micro light emitting element includes a first type semiconductor layer and a second type semiconductor layer. The first type semiconductor layer is disposed on the receiving substrate and has a first wire connecting surface away from the receiving substrate. The second type semiconductor layer is disposed on a part of the first type semiconductor layer and has a second wire connection surface away from the receiving substrate. The first wire is disposed on the first wire connection surface. The second wire is disposed on the second wire connection surface. A projection range of the first wire perpendicularly projected on the micro light emitting element and a projection range of the second wire perpendicularly projected on the micro light emitting element are at least partially overlap.

Device substrate

The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.

Electronic device and method for fabricating the same

A light emitting device including a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first electrode, and a second electrode is provided. The light emitting layer is deposited between the first and the second semiconductor layers. The first semiconductor layer, the light emitting layer and the second semiconductor layer form a stepped structure including a first electrode connection surface, a second electrode connection surface, and a connection portion. The first electrode connection surface is located on the first semiconductor layer. The second electrode connection surface is located on the second semiconductor layer. The connection portion connects the first and the second electrode connection surfaces. The connection portion includes a first surface, a second surface, and a third surface. A first corner s formed between the first and the second surfaces. A second corner is formed between the second and the third surfaces.

Light emitting device with a stepped structure

A dual-sided display is disclosed, including a substrate, a first active device, a first micro light emitting device, a patterned photoresist layer, a reflective electrode, a second micro light emitting device, a protective layer, and a first conductive electrode. The first micro light emitting device is disposed on the substrate and electrically connected to the first active device. The patterned photoresist layer is disposed on the substrate and covers a portion of the first micro light emitting device. The reflective electrode covers the patterned photoresist layer and a portion of the substrate. The second micro light emitting device is disposed on the reflective electrode. The protective layer covers the reflective electrode and a portion of the second micro light emitting device. The first conductive electrode covers the protective layer and is electrically connected to the second micro light emitting device.

Dual-sided display and method for fabricating the same

A light emitting device includes a substrate, a light emitting chip, a first electrode, and a second electrode. The light emitting chip includes a first and a second semiconductor layers. The first semiconductor layer is disposed on the substrate. The second semiconductor layer is stacked on the first semiconductor layer and forms a light emitting junction with the first semiconductor layer. The first electrode connects to the first semiconductor layer and the second electrode connects to the second semiconductor layer. The light emitting device may further include a transparent layer that is disposed on the substrate and surrounds and contacts the lateral of the light emitting chip. A refraction index of the transparent layer is between a refraction index of the light emitting chip and that of a vacuum. The first electrode may penetrate the second semiconductor layer to connect to the first semiconductor.

Light emitting device with a light emitting junction formed by stacking semiconductor layers

A micro light emitting diode structure includes a light emitting stacking layer, an insulating layer, a first electrode and a second electrode. The light emitting stacking layer includes a truncated quadrangular pyramid, wherein the truncated quadrangular pyramid includes a first sidewall, a second sidewall, a third sidewall and a fourth sidewall, and a top portion of the truncated quadrangular pyramid has a recess. The insulating layer covers the first sidewall, the third sidewall and a part of the top portion of the light emitting stacking layer. The first electrode covers the first sidewall of the light emitting stacking layer, a part of the insulating layer on the top portion, and the bottom surface of the recess. The second electrode covers the third sidewall of the light emitting stacking layer, and another part of the insulating layer on the top portion and contacts the light emitting stacking layer through an opening of the insulating layer.

Micro light emitting diode structure, pixel unit, and light emitting diode display panel

A display device includes a plurality of pixel repairing blocks and each pixel repairing block includes a first sub-pixel unit and a second sub-pixel unit. The first sub-pixel unit has a first power supply terminal and a second power supply terminal. The first power supply terminal of the first sub-pixel unit is electrically coupled to a first power line and the second power supply terminal of the first sub-pixel unit is electrically coupled to a second power line. The second sub-pixel unit has a first power supply terminal and a second power supply terminal. The first power supply terminal of the second sub-pixel unit is electrically coupled to the first power line and the second power supply terminal of the second sub-pixel units electrically coupled to a third power line. The second sub-pixel unit is adjacent to the first sub-pixel unit, and both the second sub-pixel unit and the first sub-pixel unit are configured to generate a first colored light. The plurality of pixel repairing blocks includes a first pixel repairing block. The second power supply terminal of the first sub-pixel unit of the first pixel repairing block is electrically coupled to the second power supply terminal of the second sub-pixel unit of the first pixel repairing block.

Display device

A self-emission type display including a carrier substrate, a light-emitting element, a first electrode, and a second electrode is provided. The light-emitting element is disposed on the carrier substrate and has a first pad and a second pad. The first electrode has a plurality of first stripe portions electrically connected to a first electric potential. The first pad of the light-emitting element is electrically connected to the carrier substrate through at least one first strip portion. The second electrode has a plurality of second stripe portions electrically connected to a second electric potential. The first electrode and the second electrode are separated from each other. The second pad of the light-emitting element is electrically connected to the carrier substrate through at least one second strip portion. The first electric potential is different from the second electric potential.

Self-emission type display

A wireless LAN RF module uses parasitic element compensation devices in an antenna select circuit to improve port isolation. In addition, various combinations of RC filter networks and spurious radiation attenuators are incorporated into the Quad Demod/Mod and Synthesizer ;/circuits to provide suppression of EMI susceptibility and radiation throughout the RF module.

Growing community of inventors

Hsin-Chu, Taiwan

Wen-Wei Yang