Intel Corporation

Credence Systems Corporation

Wen Wei

Neelam Chandwani

Udayan Mukherjee

Chetan Hiremath

Rakesh Dodeja

Xiaobo Huang

Kevin W Bross

Michael A Stapleton

David A Baker

Richard F Guarnero

Ron W Smith

Henry Hanson

Jagadeesh Radhakrishnan

Embodiments are generally direct to a method and apparatus to provide power to a backplane. In one embodiment, a method is implemented in a backplane to receive power through an upper zone of the backplane. The power is provided by a rear transition power entry module (RT-PEM) operatively coupled to an interface in the upper zone. The power provided by the RT-PEM is routed to interfaces in a lower zone of the backplane. Each lower zone interface distributes at least a portion of the power to a component operatively coupled to the backplane.

Method and apparatus to provide power to a backplane

Faults are monitored with information from agents for a plurality of sensors located on a plurality of circuit boards. A policy containing a error event thresholds against which the stored sensor information can be compared. Actions can be initiated by a fault module when one or more of the error event thresholds is exceeded.

Method and apparatus to monitor stress conditions in a system

A method and apparatus for a mobile personal computer (MPC) system with built-in scanner. In one embodiment, the method includes detection of the insertion of an item within a paper feed tail exposed on an exterior surface of the MPC system. In one embodiment, if insertion is detected when the MPC system is in a sleep state, a disabled scanner device is enabled to scan the item to capture an item image. Subsequently, the item image may be processed to identify the item as, for example, a business card. In one embodiment, an item image may be further processed to extract contact information from the item image. In one embodiment, when item insertion is performed during a sleep state, subsequent to completion of extraction of the contact information, components of the system awoken during the sleep state may resume the sleep state. Other embodiments are described and claimed.

Apparatus and method for a mobile personal computer system (MPC) with a built-in scanner

A modeling module is disclosed that couples to a modular platform chassis. The modeling module includes a resident management controller to implement a test to model a component layout for a module to be received and coupled to the modular platform chassis. The test includes an operating thermal load for a component resident on the module at a given location. The module has a dimensional length and width that is similar to that of the modeling module. The modeling module also includes a thermal load device that is responsive to the management controller. The thermal load device is to implement at least a portion of the test by simulating the operating thermal load for the component resident on the module at the given location.

Modeling module

A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality of fins extending from the base with at least one fin oriented at an angle to at least another fin. The method of this embodiment may also include thermally coupling the heatsink to the heat generating component. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Heatsink

This application discloses an apparatus comprising a chassis comprising a box having a perforated top, a perforated bottom and four sidewalls, wherein at least two on the sidewalls have air vents therein near the bottom, a modular fan assembly removably coupled to the top of the chassis, and a retention mechanism to removably secure the modular fan assembly to the chassis. Also disclosed is a process comprising providing a chassis including one or more server blades therein, each server blade having a power consumption, if the power consumption of each blade is below a threshold power consumption, cooling the blades using natural convection, and if the power consumption of each blade is above a threshold power consumption, cooling the blades using forced convection. Other embodiments are disclosed and claimed.

Telecom equipment chassis using modular air cooling system

A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.

Front side hot-swap chassis management module

A modular platform is provided. The modular platform includes a modular platform shelf configured to receive modular platform boards, and a dual plenum coupled to the modular platform shelf, the modular platform configured to couple to a plenum portion of a dual plenum of another modular platform or a stand-alone plenum.

Modular platform system and apparatus

A radial base heatsink is provided to dissipate heat from a heat source. Such a heatsink comprises a cylindrical core; and a plurality of cooling fins projecting outwardly from the cylindrical core and defining a series of channels in a substantially radial pattern with a fin orientation relative to a center line of the cylindrical core, for dissipating heat generated from a heat source, via the cylindrical core.

Radial base heatsink

A test head for a semiconductor integrated circuit tester comprises a housing which has an air inlet opening and an air outlet opening and bounds a pin card space and an air chamber. Multiple pin cards are located in the pin card space and radiate from an interior cavity which is within the pin card space. A baffle structure divides the air chamber, which is separated from the pin card space by a boundary surface, into an air supply duct which provides communication between the air inlet opening and the interior cavity and an outlet plenum which provides communication between the pin card space and the air outlet opening by way of the boundary surface. A fan is mounted in the interior cavity for inducing a flow of air from the interior cavity to the plenum by way of spaces between the pin cards.

Growing community of inventors

Beaverton, OR, United States of America

Wen Wei