United Microelectronics Corp.

Wen-Tsung Wu

Ju-Te Chen

Chung-An Chen

Shih-Ming Yen

Chi-Ching Huang

The invention provides an exposure method for manufacturing a device. The method includes providing a wafer having several exposure regions with a photoresist layer covering thereon. A feedback parameter map with several exposure-region feedback parameter sets respectively corresponds to the exposure regions of the wafer. At least one of the exposure-region feedback parameter sets is different from the rest of the exposure-region feedback parameter sets. According to the feedback parameter map, an exposure process is sequentially performed on each of the exposure regions of the wafer through an exposure tool to pattern the photoresist layer on the wafer. While the exposure tool performs the exposure process on each of the exposure regions, an exposure process parameter set of the exposure tool is adjusted based on the exposure-region feedback parameter sets corresponding to the exposure region in the feedback parameter map.

Exposure method

A prediction model for exposure dose is indicated by the following formula, E=E+E, wherein E represents an optimized exposure dose, Erepresents a preset exposure dose of a process control system, and Erepresents an exposure dose compensation value, and=[()/()]&#xd7;(')&#xd7;(),wherein MTTrepresents the differences between the MTT value of a previous lot and the MTT value of a next lot, CDrepresents the actual critical dimension of the mask, X represents the magnification of the mask, Erepresents the actual exposure dose of a previous lot, A&#x2032; represents an experimental value obtained from the results of different lots, Wrepresents the last batch of weights and Wrepresents an average weight, and CD, E, A&#x2032;, Wand Ware set parameters built into the process control system.

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Kaohsiung County, Taiwan

Wen-Tsung Wu