Chunghwa Precision Test Tech. Co., Ltd.

Arima Communications Corporation

Wen-Tsung Lee

Kai-Chieh Hsieh

Wei-Jhih Su

Hsun-Tai Wei

Chao-Hui Tseng

Chao-Chiang Liu

Hsien-Yu Wang

Meng-Chieh Cheng

Pang-Chi Huang

Yuan-Chiang Teng

Chih-Huang Wang

Hsiang-Lin Yu

Chao-Cheng Chou

Dung-Rur Juang

Ming-Chao Wu

Kuan-Chun Tseng

A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

Probe card device and transmission structure

A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Split thin-film probe card

A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Probe card device and fence-like probe thereof

A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

Probe card device and neck-like probe thereof

A probe card device and a directivity probe thereof are provided. The directivity probe having an elongated shape includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments respectively extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and has only one transverse slot that is recessed in one of the two broad side surfaces and that extends from one of the two narrow side surfaces to the other narrow side surface. The transverse groove has a maximum depth that is 1%-10% of a maximum distance between the two broad side surfaces. The stroke segment of the directivity probe can be bent by applying a force to the two end segments, and an inflection point of the bent stroke segment is located in the transverse slot.

Probe card device

A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

Thin-film probe card and test module thereof

The present disclosure provides a probe card device and a conductive probe thereof. The conductive probe includes a metallic pin, an outer electrode, and a dielectric layer. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, and a first contacting segment and a second contacting segment respectively extending from the first connecting segment and second contacting segment along two opposite directions away from the middle segment. At least part of the outer electrode corresponds in position to the middle segment and is arranged adjacent to the first connecting segment. The dielectric layer is sandwiched between and entirely separates the metallic pin and the outer electrode, so that the outer electrode, the dielectric layer, and the metallic pin are jointly configured to generate a capacitance effect.

A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

High speed probe card device and rectangular probe

A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Probe card device and three-dimensional signal transfer structure thereof

A probe card device is provided, and includes a plurality of conductive probes and a flat signal transfer structure that includes a transfer plate and a retaining cover. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a receiving slot recessed from the first surface and a plurality of signal circuits each having a signal contact arranged at a bottom of the receiving slot. A portion of the transfer plate arranged around and adjacent to the receiving slot is defined as a supporting portion. The retaining cover has a plurality of thru-holes and is disposed on the supporting portion. The retaining cover and the receiving slot of the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

Probe card device and matching probe thereof

A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.

Probe card device and probe head thereof

A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

Probe card testing device and testing device

A probe component and a probe structure thereof are provided. The probe structure includes a first contacting segment, a first connecting segment, a second connecting segment and a second contacting segment. The first contacting segment has an abutting portion and a first end portion connected to the abutting portion. The first connecting segment is connected to the first contacting segment. The second connecting segment is connected to the first connecting segment. The second contacting segment is connected to the second connecting segment and has a second end portion.

Probe assembly and probe structure thereof

A projector device includes an illumination module and an imaging module. The imaging module is connected to the illumination module and includes a housing, a relay optical system, and a projection optical system. The housing has a first annular receiving groove and a second annular receiving groove. The first annular receiving groove is closer to the illumination module than the second annular receiving groove. A center axis line of the first annular receiving groove and a center axis line of the second annular receiving groove are on the same axis line. The relay optical system includes a lens received in the first annular receiving groove. The projection optical system includes a lens and a reflecting mirror received in the second annular receiving groove. Mirror centers of the lenses and a mirror center the reflecting mirror are located on the same axis line.

Growing community of inventors

Taipei, Taiwan

Wen-Tsung Lee