Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Wen-Tai Wang

Sheng-Tsai Huang

Chao-Yen Huang

Chung-Hui Chen

Chun-Yu Lin

Ming-Dou Ker

Hun-Hsien Chang

Ming-Jing Ho

Ker-Min Chen

Fan-Yi Jien

Chun-Cheng Chen

Chang-Fen Hu

Shi-Hao Chen

Li-Ya Tseng

Yen-Cheng Chen

Wei-Cheng Yu

Bo-Yan Li

An electrostatic discharge (ESD) protection device includes a first clamping circuit, a second clamping circuit, and a diode circuit. The first clamping circuit is coupled between a first power rail and a second power rail. The second clamping circuit is coupled between a third power rail and the second power rail. The diode circuit is configured to steer an ESD current from an input/output pad to at least one of the first clamping circuit or the third power rail. The first power rail receives a first voltage, the second power rail receives a second voltage, the third power rail receives a third voltage, the third voltage is higher than the first voltage, and the first voltage is higher than the second voltage.

Electrostatic discharge protection device and method

A semiconductor structure corresponds to a first diode and a second diode connected in series. A first well region is on a first deep well region. Two second well regions are at two sides of the first well region respectively. A first doping region and a second doping region are on the first well region. A first isolation region is between the first doping region and the second doping region. A third well region is on a second deep well region. Two fourth well regions are at two sides of the third well region respectively. A third doping region and a fourth doping region are on the third well region. A second isolation region is between the third doping region and the fourth doping region. The second doping region and third doping region are connected. The second deep well region is separated from the first deep well region.

Semiconductor structure and electrostatic discharge protection circuit

A semiconductor structure of a work unit module includes an encircling noise-resistance structure and a P-type substrate being defined with a chip region and a surrounding region surrounding the chip region. The surrounding area includes two first strip regions and two second strip regions. Each of the first strip regions is located between the second strip regions, and each of the second strip regions is located between the first strip regions. The encircling noise-resistance structure is located on the surrounding area, and includes first arrangement units and second arrangement units. The first arrangement unit is arranged in one of the first strip regions in a single row. The second arrangement unit is arranged in one of the second strip regions in a single row, and the long axis direction of the second arrangement unit is different from the long axis direction of the first arrangement unit.

Semiconductor structure of work unit module

A diode includes a substrate, a first insulating layer, a second insulating layer, a well, a deep doped region, a first doped region, and a second doped region. The first insulating layer is disposed on the substrate. The second insulating layer is disposed on the substrate, and defines a cell region with the first insulating layer. The well is disposed on the substrate and beneath the cell region. The deep doped region is disposed in the well and beneath the cell region. The first doped region is disposed in the cell region and on the deep doped region. The second doped region is disposed adjacent to the first doped region. The second doped region is disposed on the deep doped region, and is electrically isolated from the well through the deep doped region and the first doped region.

Diode, diode string circuit, and electrostatic discharge protection device having doped region and well isolated from each other

A gate-bounded silicon controlled rectifier includes a substrate, an N-type well region, a P-type well region, a first N-type semiconductor region, a first P-type semiconductor region, a second N-type semiconductor region, a second P-type semiconductor region and a third semiconductor region. The N-type well region and the P-type well region are disposed in the substrate. The first N-type semiconductor region is disposed in the N-type well region. The first P-type semiconductor region is disposed in the P-type well region. The second N-type semiconductor region is disposed in the P-type well region and located between the first N-type semiconductor region and the first P-type semiconductor region. The second P-type semiconductor region is disposed in the N-type well region and located between the first N-type semiconductor region and the first P-type semiconductor region. The third semiconductor region is located between the second N-type semiconductor region and the second P-type semiconductor region.

Gate-bounded silicon controlled rectifier

An integrated circuit includes a main clock tree, a reference clock trunk, a reference clock buffer and a calibration circuit. The main clock tree transmits a main operation clock to an internal node via serially-coupled buffers to form a local clock at an internal node. The reference clock buffer transmits a main reference clock via the reference clock trunk to form a reference clock at a terminal node. The calibration circuit compares phases of the local clock and the reference clock to accordingly generate a control signal, so the main clock tree can adjust phase of the local clock according to the control signal.

Integrated circuit

A receiver circuit including an external terminal, a level shifter, a reset circuit, and an inverting circuit is provided. The external terminal receives the external signal. The level shifter shifts a voltage swing range of the external signal to generate a level shifting signal. The level shifter includes a pull-up unit and a pull-down unit coupled in series. The pull-up unit and the pull-down unit are alternatively switched respectively according to the external signal and the internal signal, and thus a leakage path of the level shifter is cut off for different states of the external signal. The reset circuit couples the external terminal and the level shifter and provides a reset path according to the external signal for assisting the switching of the pull-up unit and the pull-down unit. The inverting circuit couples the level shifter and inverts the level shifting signal to generate the internal signal.

Receiver circuit

A silicon controlled rectifier includes a substrate, a well, a deep doped region, a first doped region, a second doped region, a third doped region, and a fourth doped region. The well is disposed on the substrate and underneath a cell region. The deep doped region is disposed in the well. The first doped region has a first conductivity type, and is disposed in the well. The second doped region and third doped region have the first conductivity type and are disposed on the deep doped region. The fourth doped region has a second conductivity type, and is disposed between the second doped region and the third doped region. The fourth doped region is disposed on the deep doped region, and is electrically isolated from the well through the deep doped region, the second doped region, and the third doped region.

Silicon controlled rectifier

A differential circuit system is provided. The differential circuit system includes: a different circuit set including a plurality of differential circuits, a voltage regulator, and a current drainage circuit set. The differential circuits are electrically connected between a first node and a second node, and each differential circuit generates a current flowing from the first node to the second node. A high voltage is provided to the first node and a low voltage is provided to the second node. The first node receives an external voltage. According to the first voltage, the voltage regulator generates the low voltage. The low voltage is provided to the second node. The current drainage circuit set generates a drainage current in between the second node and a ground voltage. A superposed current flowing to the voltage regulator is difference of the summation of currents minus the conducting current.

Differential circuit system

A two-stage post driver circuit includes a controlling circuit, a pull-up unit and a pull-down unit. A first N-type transistor of the pull-down unit and a first P-type transistor of the pull-up unit are both connected to an output pad. The controlling circuit is used for controlling the first N-type transistor and the first P-type transistor. Consequently, when the pull-up unit or the pull-down unit is turned on, the voltage difference between the drain terminal and the source terminal of the first N-type transistor or the first P-type transistor is lower than a voltage stress.

Method of controlling two-stage post driver circuit

A receiver circuit is provided which receives an external signal of high voltage and provides a corresponding internal signal of low voltage. The receiver circuit includes a voltage limiter, a level down shifter and an inverter of low operation voltage. The level down shifter has a front node and a back node, and includes a transistor with a gate and a source respectively coupled to the voltage limiter and the inverter at the front node and the back node. The voltage limiter limits level of the external signal transmitted to the front node, the level down shifter shifts down a signal of the front node by a cross voltage to generate a signal of the back node, and the inverter inverts the signal of the back node to generate the internal signal.

Two-stage post driver circuit

ESD protection circuit is provided, which includes a detection circuit, a trigger circuit and a clamp circuit. The detection circuit includes two stacked capacitors reflecting occurrence of ESD events. The trigger circuit includes three stacked transistors controlling triggering of the clamp circuit according to operation of the detection circuit. The clamp circuit includes two stacked transistors conducting ESD path when triggered.

ESD protection circuit

For a negative-powered IC, an ESD protection circuit includes a negative voltage clamping circuit configured to provide a path for discharging ESD transient currents associated with different negative power supplies of the IC.

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Hsinchu County, Taiwan

Wen-Tai Wang