Taiwan Semiconductor Manufacturing Comp. Ltd.

Wen-Sheng Wu

Fei-Fan Chen

Chien Kuo Huang

Chia-I Shen

Wen-Cheng Cheng

Hua-Sheng Chiu

Yue-Ying Jian

Wei-Jen Huang

Jian-Bin Chiou

Jien-Ren Chen

A system and method for generating and using plasma is provided. An embodiment comprises a plasma generating unit that comprises beta-phase aluminum oxide. A precursor material is introduced to the plasma generating unit and a plasma is induced from the precursor material. The plasma may be used to deposit or etch materials on a semiconductor substrate.

Remote plasma system and method

A first embodiment is a method for semiconductor processing. The method comprises forming a component on a wafer in a chamber; determining a non-uniformity of the plasma in the chamber, the determining being based at least in part on the component on the wafer; and providing a material on a surface of the chamber corresponding to the non-uniformity. The forming the component includes using a plasma. The material can have various shapes, compositions, thicknesses, and/or placements on the surface of the chamber. Other embodiments include a chamber having a material on a surface to control a plasma uniformity.

Plasma density control

A method for cleaning and refurbishing a chamber component includes placing a chamber component having process deposits on an exterior surface in a plasma vapor deposition chamber. The chamber component is bombarded with a plasma comprising Argon for a period of time sufficient to remove the process deposits from the exterior surface of the chamber component.

Plasma cleaning for process chamber component refurbishment

An apparatus for shear testing bonds on 8&#x2033; and 12&#x2033; silicon substrates. The apparatus includes a removable platform for securing the 8&#x2033; wafer and a vacuum chuck for securing a 12&#x2033; wafer and the removable platform at the same time. A control module controls a moving mechanism to shift a probe to contact the solder ball of the 12&#x2033; substrate secured on the vacuum chuck or the solder ball of the 8&#x2033; wafer on the removable platform when the removable platform is fixed on the vacuum chuck. The moving mechanism moves the probe in a direction to separate the solder ball from the wafer. A sensor measures the pulling force exerted on the probe when the probe is moved in a direction and separates the solder ball from the wafer.

Growing community of inventors

Hsinchu, Taiwan

Wen-Sheng Wu