Siliconware Precision Industries Co., Ltd.

Wen-Shan Tsai

Chang-Fu Lin

Chee-Key Chung

Kuo-Hua Yu

Yu-Lung Huang

Wei-Ping Wang

Hung-Wen Liu

Kaun-I Cheng

Lien-Chen Chiang

En-Li Lin

Chien-Feng Wei

Ming Cheng Lin

An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.

Electronic package, method for fabricating the same, and heat dissipator

An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.

Electronic package and method for fabricating the same

A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.

Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure

Growing community of inventors

Taichung, Taiwan

Wen-Shan Tsai