Taiwan Semiconductor Manufacturing Comp. Ltd.

E Ink Holdings Inc.

Wen-Pin Liu

Chien-Hung Lin

Ya-Ping Chen

Chun-Jen Hsiao

Chin-Wen Chen

Chih-Wei Hsu

Chi-Mao Hung

Jong-I Mou

Chun-Hsien Lin

Jo Fei Wang

Yu-Jen Cheng

Pei-Lin Tien

Hsiao-Lung Cheng

Shin-Rung Lu

Andy Tsen

Shu-Cheng Liu

Ching-Hsi Nan

Hann-Ru Chen

Yu-Hsiu Fu

Shun-Ping Wang

An electronic paper display and a driving method thereof are provided. The electronic paper display includes an electronic paper display panel, a touch panel and a processing circuit. The touch panel outputs a first touch coordinate of a current touch and a second touch coordinate of a next touch. The processing circuit executes a filter module and a line drawing module. The filter module outputs a first measured position data and a first predicted position data to the line drawing module. The line drawing module drives the electronic paper display panel to display a first predicted track. The filter module outputs a second measured position data to the line drawing module. The line drawing module determines whether a second track display coordinate corresponding to the second measured position data is equal to the first predicted display coordinate to correct the first predicted track.

Electronic paper display and driving method thereof

A plasma ashing method is provided. The plasma ashing method includes analyzing the process status of each of a number of semiconductor substrate models undergoing a tested plasma ash process by a residue gas analyzer. The tested plasma ash processes for the semiconductor substrate models utilize a plurality of tested recipes. The plasma ashing method further includes selecting one of the tested recipes as a process recipe for a plasma ash process.

Plasma ashing method using residue gas analyzer

An electronic paper display and a driving method thereof are provided. The electronic paper display includes an electronic paper display panel, a touch panel and a processing circuit. The electronic paper display panel is configured to display a display screen with a background in a first color. The touch panel is integrated with the electronic paper display panel and configured to output a first touch coordinate of a current touch. The processing circuit is configured to drive the electronic paper display panel to display a first touch track having a second color and corresponding to the first touch coordinate and a previous touch coordinate. The processing circuit further drives, according to the first touch track and a previous touch track, the electronic paper display panel to display a predicted track having a third color.

A photoresist removal method is provided. The photoresist removal method includes analyzing the process status of each of a number of semiconductor substrate models undergoing a tested plasma ash process by a residue gas analyzer. The tested plasma ash processes for the semiconductor substrate models utilize a plurality of tested recipes. The photoresist removal method further includes selecting one of the tested recipes as a process recipe based on the analysis results from the residue gas analyzer and at least one expected performance criterion. In addition, the photoresist removal method includes performing a plasma ash process on a semiconductor substrate according to the process recipe to remove a photoresist layer from the semiconductor substrate.

Photoresist removal method using residue gas analyzer

The present disclosure provides a method for determining an applicability of a specific processing device having a specific processing pattern. The method includes the following steps: locating a similarity index between the specific processing pattern and a reference processing pattern of a reference processing device; and confirming the applicability of the specific processing device if the similarity index is no less than a threshold. Besides, a method for assessing an applicability of a new processing pattern for a specific processing device, and a method for determining an applicability of an alternative processing path for a reference processing path are also provided.

Method for determining applicabilty of a processing device, a processing path and a processing pattern

The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.

Advanced process control for new tapeout product

Growing community of inventors

Hsinchu, Taiwan

Wen-Pin Liu