Orient Semiconductor Electronics, Limited

Wen-Long Leu

Chia-Chieh Hu

Hui-Pin Chen

Ning Huang

Fu-Yu Huang

Chung-Ming Chang

Feng-Chang Tu

Wen-Lo Shieh

Hsuan-Jui Chang

Hua-Wen Chiang

A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Semiconductor chip package with cooling arrangement

A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Method and device for making a metal bump with an increased height

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Taipei, Taiwan

Wen-Long Leu