Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Integrated System Solution Corporation

Integrated Systems Solution Corp.

Wen-Lin Chen

Chin-Liang Chen

Kuan-Lin Ho

Yu-Min Liang

Chi-Yang Yu

Albert Chen

Hung-Cheng Chen

Sheng-Fuh Chang

Shu-Fen Tang

Yi-Chin Hsu

Sheng-Rong Huang

Yi-Yu Lu

Cheng-Hua Tsai

Chin-Hung Chien

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Semiconductor package and manufacturing method thereof

The present invention discloses an antenna diversity switch, used for receiving and transmitting RF signals for dual-mode co-existence wireless communication system. The antenna diversity switch comprises a first transmitting port; a second transmitting port; a receiving port; a first control unit, electrically connected between the first transmitting port and a first antenna; a second control unit, electrically connected between the first transmitting port and a second antenna; a third control unit, electrically connected between the second transmitting port and the first antenna; a forth control unit, electrically connected between the second transmitting port and the second antenna; a fifth control unit, electrically connected between the receiving port and the first antenna; a sixth control unit, electrically connected between the receiving port and the second antenna. The antenna diversity switch according to the present invention meets the requirement of IEEE 802.11b/g WLAN and Bluetooth co-existence operation with reduction of three or four antennas in the prior art to two antennas. Moreover, it provides antenna diversity for both WLAN and Bluetooth systems, where in the prior-art WLAN and Bluetooth co-existence system only WLAN system has the antenna diversity.

Antenna diversity switch of wireless dual-mode co-existence systems

The present invention discloses a dual-band RF transceiver. The transceiver comprises a first module, used as the RF front-end of the dual-band transceiver and used for receiving and transmitting a first RF signal and a second RF signal; a second module, electrically connected to the first module, used as the IF IQ modulator/demodulator of the dual-band RF transceiver; a third module, electrically connected to the first and the second modules, used as the tripe-band phase-locked frequency synthesizer of the dual-band RF transceiver and used for providing a first local oscillating signal and a second local oscillating signal to the first module, and a third local oscillating signal to the second module. The dual-band RF transceiver according to the present invention realizes the dual-band triple-mode operation of IEEE802.11 a/b/g by a single dual-band RF module, and therefore the circuit size, power dissipation, component count, and cost can be dramatically reduced.

Dual-band wireless LAN RF transceiver

The present invention discloses a gain amplifier, capable of concurrently operating at three different frequency bands. The gain amplifier comprises an amplification stage for amplifying a signal applied to an input of the amplifier and a triple-band resonance load connected between a DC bias voltage and a DC bias input of the amplification stage. The triple-band resonance load uses a set of reactive elements to provide match in a first frequency band, a second frequency band and in a third frequency band, such as at 2.4 GHz, 5.8 GHz and 9.0 GHz. According to the gain amplifier of the present invention, it can effectively provide triple-band signal amplification and in-band interference suppression for various multi-standard coexist communication systems.

Concurrent triple-band gain amplifier for multi-standard coexist communications

A method and system are provided for operating a data processing system including a data base computer system and a resource allocation computer for control of resource allocation in a manufacturing plant with a manufacturing line comprising a plurality of stages with manufacturing machines, the resource allocation computer including data storage means. The method includes several steps including: deriving data from the data storage means and computing the targets for each of the stages; obtaining machine capacity data from the data storage means and employing the machine capacity data for allocating machine capacity proportionally and adjusting targets; adding limits to stages of penetration and adjusting targets; determining residual capacity and allocating the residual capacity of the manufacturing machines; and checking the convergence of targets and machine allocation until convergence is achieved.

Daily target generation and machine allocation with priority

Growing community of inventors

Hsinchu, Taiwan

Wen-Lin Chen