National Applied Research Laboratories

Epistar Corporation

Wen-Kuan Yeh

Shih-Chang Lee

Jen-Inn Chyi

Ta-Cheng Hsu

Rong-Ren Lee

Meng-Yang Chen

Shih-Pang Chang

Szu-Hung Chen

Guang-Li Luo

Mei-Yi Li

Jia-Min Shieh

Kuo-Chun Chang

Yu-Sheng Lai

Kang-Lung Wang

Yung-Bin Lin

Min-Cheng Chen

Cheng-San Wu

Yung-Kang Wang

Meng-Huang Gu

Guoqiang Yu

Kai-Shin Li

Bo-Wei Wu

Yann-Wen Lan

Qiming Shao

Ho-Min Chang

Yuan-Chen Liao

A method of making a semiconductor device includes: providing a substrate; forming an insulating layer on the substrate; forming a first trench in the insulating layer; forming a first semiconductor layer in the first trench; and removing a portion of the insulating layer to expose the first semiconductor layer.

Heterogeneously integrated semiconductor device and manufacturing method thereof

A heterogeneously integrated semiconductor device includes a substrate comprising a first material; a recess formed within the substrate and having a bottom portion with a first width, a top portion with a second width and a middle portion with a third width larger than the first width and the second width; and a first semiconductor layer filled in the bottom portion and including a second material different from the first material.

A field-effect transistor structure having two-dimensional transition metal dichalcogenides includes a substrate, a source/drain structure, a two-dimensional (2D) channel layer, and a gate layer. The source/drain structure is disposed on the substrate and has a surface higher than a surface of the substrate. The 2D channel layer is disposed on the source and the drain and covers the space between the source and the drain. The gate layer is disposed between the source and the drain and covers the 2D channel layer. The field-effect transistor having two-dimensional transition metal dichalcogenides is a planar field-effect transistor or a fin field-effect transistor.

Field-effect transistor structure having two-dimensional transition metal dichalcogenide

The present invention relates to an inductive spin-orbit torque device and the method for fabricating the same. The method comprises steps of depositing a two-dimensional thin film using chemical vapor deposition (CVD) and sputtering a ferromagnetic material on the thin film. The crystal structure of the two-dimensional thin film includes at least one lattice plane arranged asymmetrically. The thickness of the two-dimensional thin film includes at least one unit-cell layer. The sum of the at least one unit-cell layer is an odd number. By using the vertical magnetic torque generated by the two-dimensional thin film and the miniaturization in thickness, the device size and the fabrication costs may be reduced.

Inductive spin-orbit torque device and method for fabricating the same

An environment monitoring system is utilized for monitoring an environmental variation status of a riverbed, a lake floor, or a seabed. The environment monitor system includes a wire drawing device configured at a monitoring point for releasing and tightening a transmission wire; a fixing pipe laid between the monitoring point and a structure layer for containing the transmission wire; a plurality of vibration sensing devices respectively configured on the transmission wire for converting sensed vibration energy to a plurality of electric signals and transmitting the plurality of electric signals by the transmission wire; an analyzing device coupled with the wire drawing device and the transmission wire for obtaining a released length of the transmission wire by the wire drawing device and determining the environmental variation status according to the released length and the plurality of electric signals to perform monitoring.

Environment monitoring system and vibration sensing device

A heterogeneously integrated semiconductor devices includes a base substrate; a Ge-containing film formed on the base substrate; a PMOSFET transistor having a first fin formed on the Ge-containing film; and a NMOSFET transistor having a second fin formed on the Ge-containing film; wherein the PMOSFET transistor and the NMOSFET transistor compose a CMOS transistor, and the first fin comprises Ge-containing material and the second fin comprises a Group III-V compound.

Growing community of inventors

Hsinchu, Taiwan

Wen-Kuan Yeh