Industrial Technology Research Institute

Slight Opto-Electronics Co., Ltd.

Wen-Jong Chen

Chih-Kung Lee

Hui-Lung Kuo

Pao-Ju Hsieh

Long-Sun Huang

Ching-Heng Tang

Ching-Hua Lee

The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process. Alternatively, the composite substrate and the un-sliced wafer can be bonded together by cold compression or thermal compression. The resultant wafer is then sliced into separated image sensors for further packaging, such as CLCC, PLCC, QFP, QFN or QFJ. Alternatively, the resultant wafer can be packaged through a wafer-level chip scale packaging process.

Method for integrating image sensors with optical components

A reflective-type diffraction grating structure for use in color display devices such as liquid crystal displays (LCDs). It contains: (1) a plurality of micro-lenses each having a smooth top surface and a blazed zig-zag-shaped grating surface at the bottom; (2) an optical coating formed below the zig-zag-shaped grating surface; and (3) a reflective member formed below the optical coating. With the cooperative actions of the zig-zag-shaped grating surface, the optical coating layer, and the reflective member, an incident light, when reflected, is separated into repeated sequences of red, green, and blue color components and a black matrix segregating the red, green, and blue color components. A sequence of micro-light valves are placed in the path of the reflected incident light to block the undesired color components. The reflective-type diffraction grating structure dispenses with the need for the various layers of color filters. As a result, it improves the brightness of the image and reduces power consumption, as well as reducing the manufacturing cost.

Reflective diffraction grating for use in display devices

Growing community of inventors

Taipei, Taiwan

Wen-Jong Chen