Power Wave Electronic Co., Ltd.

Compal Electronics, Inc.

Power Wave Electronics Co., Ltd.

Wen-Jiao Liao

Yun-Chan Tsai

Wei-Hong Tsai

Shih-Chia Liu

Li-Chun Lee

Yen-Hao Yu

Liang-Che Chou

Jhin-Ciang Chen

Shi-Hong Yang

Hao-Ju Hsieh

Shih-Hsun Hung

A chip-type antenna structure includes a baseboard, a matching element, a radiation single body and a frequency-modulation element. The baseboard includes a first-ground surface, a first-clearance area and a signal-feed-in unit. A second-ground surface, a second-clearance area, a third-ground surface and a plurality of via holes through the baseboard and electrically connected to the first-ground surface and the second-ground surface are arranged on the other side of the baseboard. The matching element is electrically connected between the signal-feed-in unit and the first-ground surface. One side of the radiation single body is electrically connected to the signal-feed-in unit through the via holes. The other side of the radiation single body is electrically connected to the third-ground surface. The frequency-modulation element is electrically connected between the second-ground surface and the third-ground surface to adjust the frequency-modulation element to adjust a receiving-transmitting frequency of the chip-type antenna structure.

Chip-type antenna improved structure

A dual-band antenna is provided. The dual-band antenna includes a first antenna, a second antenna, and a grounding component. The first antenna has a first feed point for transceiving a first signal. The second antenna has a second feed point. The grounding component is electrically coupled to the first feed point and the second feed point, wherein the grounding component forms a first path and a second path between the first feed point and the second feed point, wherein a first path length of the first path and a second path length of the second path are integer multiples of a first wavelength of the first signal.

Dual-band antenna

An enhanced printed circuit board monopole antenna includes a baseplate, a signal feed-in unit, a first-radiation unit, a second-radiation unit and an auxiliary ground unit. The first-radiation unit and the second-radiation unit are arranged on a front side and an edge side of the baseplate. The auxiliary ground unit is arranged on the edge side and electrically connected to a first ground unit and a second ground unit on the baseplate. Adjusting the first-radiation unit controls 88 MHZ-60 GHZ frequency range impedance, resonant frequency, bandwidth and radiation effect. According to the frequency wave length (1&#x3bb;, &#xbd;&#x3bb;, &#xbc;&#x3bb; or &#x215b;&#x3bb;) formed by the first-radiation unit and the second-radiation unit cooperating with each other, controlling 88 MHZ-60 GHZ frequency range achieves the predetermined target impedance, resonant frequency, bandwidth and radiation efficiency. The antenna radiation efficiency can be increased effectively.

Enhanced printed circuit board monopole antenna

A multi-band antenna including a ground portion, a first radiation portion, a second radiation portion, a feeding portion and a matching portion is provided. The first radiation portion is disposed beside the ground portion, a first gap is existed between the ground portion and the first radiation portion so as to form a first slot, and the first slot has a first open terminal located at the first gap. The second radiation portion is connected to the first radiation portion. The feeding portion is located between the first radiation portion and the second radiation portion. The matching portion is located in the first slot and connected to the first radiation portion and the ground portion. The feeding portion excites the first slot to generate a first resonant mode. The second radiation portion generates a second resonant mode.

Multi-band antenna

A method for manufacturing chip signal elements includes steps as follows. A substrate is provided. A plurality of through holes is drilled, and a plurality of side holes is formed along the through holes. A first cooper-plating process is performed to form a plurality of conductive layers electrically connected to the upper and the lower metal layer. A second cooper-plating process is performed to increase thickness of the conductive layers. A first and a second pattern layers are formed on the substrate by an etching. The first pattern layer is electrically connected to the second pattern layer to form a spiral radiator. An ink is printed on the substrate to cover the spiral radiator and form a solder mask layer. An organic metal process and a plating process are performed to form terminal electrodes. Finally, a single chip signal element having a spiral radiator is formed.

Method for manufacturing chip signal elements

A single feed-in dual-band antenna structure includes a first radiation unit, a basal plate and a plurality of matching components. The basal plate includes a front side, a back side and an edge side. A first ground unit, a signal feed-in unit, a second radiation unit and an electrode part are arranged on the front side. A third radiation unit is arranged on the edge side. A second ground unit is arranged on the back side of the basal plate. The first radiation unit is electrically connected to the electrode part. The first radiation unit is adjusted to control the 2.45 GHZ frequency range impedance, resonant frequency, bandwidth and radiation effect. The third radiation unit frequency wave length controls the 5 GHZ frequency range to achieve the predetermined target impedance, resonant frequency, bandwidth and radiation efficiency. The antenna size can be reduced effectively.

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Taipei, Taiwan

Wen-Jiao Liao