National Chung Shan Institute of Science and Technology

Wen-Jen Lin

Shiang-Feng Tang

Kun-Chi Lo

Shun-Lung Yen

Yi-Yuh Hwang

Chin-Der Hwang

Wei-Guo Chang

Sheng-Hui Chen

Guang-Sheen Liu

Ping-Kuo Weng

Yau-Tang Gau

Shih-Hao Chan

Yin-Yi Wu

Shao-Ze Tseng

Ping-Ya Ko

A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.

High-precision non-contact temperature measurement device

The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

High-accuracy contactless measurement method for measuring temperature of metal thermoforming mold

A microbolometer read-out circuit includes an extraction circuit configured to detect a voltage signal of a temperature variation; an analog-to-digital converter coupled to the extraction circuit and configured to digitalize the voltage signal of the temperature variation; an image processing circuit coupled to the analog-to-digital converter; and wherein the image processing circuit is coupled to a gain digital-to-analog converter and an offset digital-to-analog converter.

Microbolometer readout circuit and calibration method using the same

A temperature measurement correction method for a temperature detection device is provided. The temperature detection device includes a case and a focal plane array module disposed on an inner of the case. The temperature measurement correction method includes measuring an ambient temperature, a temperature of the case and a temperature of the focal plane array module, determining a plurality of radiometric regression coefficients according to the ambient temperature, the temperature of the case and the temperature of the focal plane array module, utilizing the temperature detection device to sense infrared energy radiated from an object to generate an electrical signal, and calculating an actual temperature value of the object according to the plurality of radiometric regression coefficients and the electrical signal.

Temperature measurement correction method, electronic system and method of generating correction regression coefficient table

An infrared anti-reflection film structure, an anti-reflection film layer, including a material of zinc oxide, comprising a top anti-reflection film layer and a bottom anti-reflection film layer, wherein the top anti-reflection film layer is disposed on a top side of the base material and the bottom anti-reflection film layer is disposed on a bottom side of the base material; and the base material is manufactured by a floating zone crystal growth method. Through the silicon base material manufactured by the high purity crystal growth method, the silicon base material replaces germanium as the high refractive index material and base material. And coating the anti-reflection film layer on the surface of the silicon base material, so as to apply the infrared anti-reflection film structure to the thermal imaging technology.

Infrared anti-reflection film structure

A quick subpixel absolute positioning device and method are introduced. The method includes the steps of (A) capturing a real-time speckle pattern of a target surface; (B) providing a coarse-precision speckle coordinate pattern and a plurality of fine-precision speckle coordinate patterns, wherein the coarse-precision speckle coordinate pattern and the fine-precision speckle coordinate patterns include a coordinate value; (C) comparing the real-time speckle coordinate pattern with the coarse-precision speckle coordinate pattern by an algorithm and then comparing the real-time speckle coordinate pattern with the fine-precision speckle coordinate patterns to obtain a coordinate value, wherein each said coarse-precision speckle coordinate pattern corresponds to a set of fine-precision speckle coordinate patterns, and the fine-precision speckle coordinate patterns are obtained when the coarse-precision speckle coordinate pattern is captured again and then captured repeatedly according to a fixed fine-precision displacement distance. Accordingly, the subpixel positioning is attained by quick comparison and manifests high precision.

Growing community of inventors

Taoyuan, Taiwan

Wen-Jen Lin