Taiwan Semiconductor Manufacturing Comp. Ltd.

Wen-Hung Wu

Yung-Liang Kuo

Kun-Pi Cheng

Hsu Ming Cheng

Ann Luh

Pi-Huang Lee

Frank Hwang

A universal system for testing different semiconductor devices provides a probe head with a probe pattern that may be used to test different test patterns formed on different semiconductor devices. Each of a plurality of bumps or pads of the test pattern contacts a corresponding probe of the probe head to enable the semiconductor device to be tested. The universal probe head may additionally or alternatively include a substrate design on the probe head that provides a pattern on the substrate of the probe head that may be used in conjunction with different patterns formed on a plurality of different printed circuit boards for testing different semiconductor devices.

Universal array type probe card design for semiconductor device testing

A method for determining an overlay registration correction for a new product lot of a microelectronic product type with respect to a specific alignment tool within a foundry facility first provides for determining: (1) a first average historic overlay registration correction for historic product lots of the new product lot type with respect to the specific alignment tool; and (2) a second average historic overlay registration correction with respect to product lots of any product type with respect to the specific alignment tool. The overlay registration correction is determined as the sum of: (1) an overlay registration correction for an immediately preceding layer within the new product lot, if present; (2) a factor derived from the first average historic overlay registration correction; and (3) a factor derived from the second average historic overlay registration correction.

Overlay registration correction method for multiple product type microelectronic fabrication foundry facility

Growing community of inventors

Hsinchu, Taiwan

Wen-Hung Wu