Industrial Technology Research Institute

Wen-Hung Liu

Yu-Min Lin

Chang-Sheng Chen

Sheng-Tsai Wu

Hsuan-Yu Lin

Ang-Ying Lin

Po-Kai Chiu

Ting-Yu Wang

An integrated antenna package structure includes a first redistribution structure, a first chip, a heat dissipation structure, a second chip, and an antenna structure. The first chip is located on a first side of the first redistribution structure, and is electrically connected to the first redistribution structure. The heat dissipation structure is thermally connected to the first chip, and the first chip is located between the heat dissipation structure and the first redistribution structure. The second chip is located on a second side of the first redistribution structure opposite to the first side, and is electrically connected to the first redistribution structure. The antenna structure is electrically connected to the first redistribution structure.

Integrated antenna package structure

A light emitting device including a substrate, a first electrode, a light emitting layer, a second electrode, a heat shrinkable film and a first adhesive layer is provided. The first electrode is disposed on the substrate. The light emitting layer is disposed on the first electrode. The second electrode is disposed on the light emitting layer. The first electrode, the light emitting layer, and the second electrode are sequentially stacked on the substrate to form a light emitting cell. The heat shrinkable film is disposed on the light emitting cell. The first adhesive layer is disposed between the heat shrinkable film and the second electrode.

Light emitting device

Growing community of inventors

Taichung, Taiwan

Wen-Hung Liu