Phoenix Precision Technology Corporation

Unimicron Technology Corporation

Wen-Hung Hu

Shih-Ping Hsu

Chao-Wen Shih

Ying-Tung Wang

Sao-Hsia Tang

Wen-Yuan Chi

Meng-Da Chou

A semiconductor package substrate structure and a manufacturing method thereof are disclosed. The structure includes a substrate having a plurality of electrical connecting pads formed on at least one surface thereof; a plurality of electroplated conductive posts each covering a corresponding one of the electrical connecting pads and an insulating protective layer formed on the surface of the substrate and having a revealing portion for exposing the electroplated conductive posts therefrom. The invention allows the interval between the electroplated conductive posts to be minimized, the generation of concentrated stresses and the overflow of underfill to be avoided, as well as the reduction of the overall height of the fabricated package.

Semiconductor package substrate structure and manufacturing method thereof

A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection. The conductive posts and electrically connecting pads are absent from the insulating protective layer beneath the standalone metal pads, such that circuits can be formed under the insulating protective layer.

Circuit board having electrically connecting structure and fabrication method thereof

A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to expose the electrical connecting pads on the circuit board and tapered upward; and a conductive element formed in the opening, so as to increase the contact area and reinforce bonding between the electrically connecting pads and the conductive element.

Circuit board surface structure

A conductive bump structure of a circuit board and a method for forming the same are proposed. A conductive layer is formed on an insulating layer on the surface of the circuit board. A first resist layer is formed on the conductive layer and a plurality of first openings is formed in the first resist layer to expose the conductive layer. Then, a patterned trace layer is electroplated in the first openings and a second resist layer is covered on the circuit board with the patterned trace layer. Second openings are formed in the second resist layer to expose part of the trace layer to be used as electrical connecting pads. Thereafter, metal bumps are electroplated in the second openings and the surface of the circuit board is covered with a solder mask. A thinning process is applied to the solder mask to expose the top surface of the metal bumps. Afterwards, an adhesive layer is formed on the surface of the metal bumps exposing out of the solder mask.

Conductive bump structure of circuit board and method for forming the same

A semiconductor package substrate includes a main body with a surface having a first circuit layer thereon and a dielectric layer covering the first circuit layer, with a plurality of vias on a portion of the first circuit layer; a plurality of first conductive vias disposed in the vias; a plurality of first electrically connecting pads on the first conductive vias and completely exposed on the dielectric layer having no extending circuits for a semiconductor chip to be mounted thereon, the first electrically connecting pad being electrically connected to the first circuit layer of the first conductive via; and an insulating protective layer disposed on the main body with an opening for completely exposing the first electrically connecting pads, whereby the circuit layout density is increased without disposing circuits between the electrically connecting pads.

Semiconductor package substrate

A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, wherein openings are formed in the layers at positions corresponding to the pads to expose the pads. Then, a conductive layer is formed on surfaces of the resist layer and openings, and a metal layer is formed on the conductive layer via electroplating and filled in the openings. Subsequently, the metal layer and conductive layer formed on the resist layer are removed via thinning, so as to form metal bumps on the pads. After the resist layer is removed, the metal bumps are covered by an adhesive layer to form a conductive bump structure for electrically connecting the circuit board to the external electronic component.

Method for fabrication of a conductive bump structure of a circuit board

Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.

Conductive structures for electrically conductive pads of circuit board and fabrication method thereof

An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second resist layer thereon, so as to form electrical connection pads and metal bumps on the electrical connection pads. The first and second resist layers are formed with openings therein at positions corresponding to the electrical connection pads and metal bumps, and the exposed conductive layer is removed. An adhesive layer is formed to cover the exposed surfaces of the electrical connection pads and the metal bumps. Then, the second resist layer, the first resist layer and the conductive layer covered by the first resist layer are removed. Later, an insulating protective layer is formed on a surface of the circuit board, and thinned to expose a portion of the adhesive layer, such that electrical connectors of the circuit board are fabricated.

Electrical connector structure of circuit board and method for fabricating the same

A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board. Subsequently, a resist layer is formed on the second surface of the circuit board to cover the conductive bump, and another resist layer having openings penetrating therethrough is formed on the first surface of the circuit board to expose the conductive pad. Finally, a conductive bump is formed on the conductive pad located on the first surface of the circuit board by an electroplating process. By such arrangement, the conductive bumps are successively formed on the first surface and the second surface of the circuit board.

Method for fabricating conductive bump of circuit board

A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

Growing community of inventors

Hsin-Chu, Taiwan

Wen-Hung Hu