Au Optronics Corporation

Wen-Hui Peng

Che-Chih Chang

Chia-Jung Wu

Yu-Ching Chen

Chih-Hao Chang

Chih-Chun Chen

Tsai-Chi Yeh

Shang-Kung Tsai

Chien-Chung Chen

Ting-Shiun Huang

Sheng-Yun Hsu

Yu-Meng Kao

A pixel array substrate includes a substrate having a display region and a non-display region, a pixel array in the display region, first and second lead lines, first pads in the non-display region, second pads in the non-display region and on a first insulating layer, and the first insulating layer. The first lead lines electrically connect the pixel array and extend from the display region to the non-display region. Each first pad electrically connects one corresponding first lead line. The first insulating layer covers the first lead lines and exposes the first pads. The second lead lines on the first insulating layer electrically connect the pixel array and extend from the display region to the non-display region. Each second pad electrically connects one corresponding second lead line. A distance between each first pad and the adjacent second pad along a horizontal direction is 10 um&#x2dc;20 um.

Pixel array substrate, conductive structure and display panel

A display module includes components of a display panel having an outward first FPC for connecting to a system, wherein the first FPC has a foldable part on which a welding area is defined, and a backlight unit opposite to the display panel for providing illumination for the display panel. The backlight unit has an outward second FPC which is welded with the welding area of the foldable part. Both the foldable part and second FPC are folded and turned around to keep the welding area attach to the backside of the backlight unit.

Planar display module

A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. In one device, each connector has a strip connected to a bump pad. The bump pad is superimposed on and electrically connected to a bump pad on the other device. Each strip has a certain required strip width and each bump pad has a certain required pad width. The connectors are grouped into a group of three or more. Within each group, a strip is connected to a bump pad along one side edge thereof, and the bump pads are offset in two directions such that after the bump pads are superimposed, the pattern of the connected connectors in each group of connectors resembles a plurality of zigzag paths offset to maintain a constant gap between two strips. As such, the gap between two connectors can be minimized.

Electrical connection pattern in an electronic panel

A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. Each connector has a strip connected to a bump pad. Each strip has a certain required strip width and each bump pad has a certain required pad width. Each bump pad on one electronic device is electrically connected to a corresponding bump pad on the other device by superimposition. The connectors are grouped into a group of three or more. Within each group, a strip is connected to a bump pad along one side edge thereof, and the bump pads are offset in two directions such that after the bump pads are superimposed, the pattern of the connected connectors in each group of connectors resembles a plurality of zigzag paths offset to maintain a constant gap between two strips. As such, the gap between two connectors can be minimized.

Growing community of inventors

Hsinchu Hsien, Taiwan

Wen-Hui Peng