Globalfoundries Inc.

Wen Hua Cheng

Dongsuk Park

Wangkeun Cho

Methods and processes for forming semiconductor devices with reduced yield loss and failed dies are provided. One method includes, for instance: obtaining a wafer after at least one fabrication processing; taking first r, &#x3b8;, z measurements of the wafer after the at least one fabrication processing; performing at least one second fabrication processing; taking second r, &#x3b8;, z measurements of the wafer after the at least one second fabrication processing; and analyzing the second r, &#x3b8;, z measurements with respect to the first r, &#x3b8;, z measurements. A process includes, for instance: obtaining a wafer with a substrate and at least one first device positioned on the substrate; taking first measurements in a r, &#x3b8;, z coordinate system; forming at least one second device over the substrate; taking second measurements in the r, &#x3b8;, z coordinate system; and analyzing the second measurements with respect to the first measurements.

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Clifton Park, NY, United States of America

Wen Hua Cheng