Dicon Fiberoptics, Inc.

Wen-Herng Su

Ho-Shang Lee

Junying Lu

Feng Ye

David Polinsky

George C Chen

This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Light emitting diode submount with high thermal conductivity for high power operation

In order to tune the frequencies of radiation sources, a frequency locker is provided having equally spaced periodic frequencies with a spectral range substantially equal to the frequency spacing of a plurality of radiation sources with equally spaced apart frequencies. The periodic frequencies of the locker are slightly offset from those of the radiation sources. Radiation from each of the sources is passed through the locker and the radiation passed by the locker is detected and used to adjust the frequencies of the sources in order to tune the sources. The frequency locker includes an etalon with dimensions accurate to 0.5 microns or better. The dimension of the etalon may be controlled by controlling the thickness of spacers for maintaining vacuum or air gaps where the dimensions may be altered by thin film deposition and etching techniques. The optical path length of the etalon may also be changed by altering the angle of incidence of an incoming beam with the reflective surfaces of the etalon.

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Moraga, CA, United States of America

Wen-Herng Su