Data Storage Institute

Advanced Micro Devices Corporation

Wen Dong Song

Minghui Hong

Yong Feng Lu

Chengwu An

Zhihong Mai

Yongfeng Lu

Ming Hui Hong

Kok Tong Thiam

Chye Eng Soh

This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. COlaser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after COlaser deflashing. COlaser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

Method and apparatus for deflashing of integrated circuit packages

The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.

Method and apparatus for decapping integrated circuit packages

A method of patterning a substrate includes forming a liquid film on the substrate surface and directing laser energy from a laser through the film to etch the substrate surface. Etched material is carried away from the substrate surface via evaporation of the film during the etching. The liquid film may be formed on the substrate surface by jetting a liquid vapor onto the substrate.

Method of patterning a substrate

This invention relates to a method and apparatus for removing surface contamination on a flexible circuit for an inkjet printer cartridge by pulsed laser irradiation in air. The contamination around and inside the tiny inkjet nozzles can be completely removed without any damage on the flexible circuit by the laser irradiation. The cleaning mechanisms are laser-induced ablation of the contamination and fast momentum transferring from the laser beam to the contamination materials. Compared with chemical solution cleaning and plasma etching, this technique has high throughput and does not cause flexible circuit damage, due to the fact that there are no water and chemical solutions involved in the process. Meanwhile, the laser irradiation is only limited in a small area around the tiny inkjet nozzles . There is no laser interaction with the thin conductive circuit

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Singapore, Singapore

Wen Dong Song