Epistar Corporation

Yenrich Technology Corporation

Wen-Chien Wu

Ching-Tai Cheng

Wei-Shan Hu

A backlight module is provided. The backlight module includes a substrate having a substrate surface, a conductive layer disposed on the substrate surface, a plurality of LED chips disposed on and electrically connected to the conductive layer, a light-permeable layer having a light-permeable surface away from the substrate surface, and a pattern layer disposed on the light-permeable surface and having a plurality of first patterns corresponding to and respectively located above the plurality of LED chips. Wherein, each first pattern has a maximum width. A maximum width of one first pattern satisfies the following formula:&#x2265;2()(1&#x2212;1/);wherein Wis the maximum width of one first pattern, n is a refractivity of the light-permeable layer, Tis a thickness of the light-permeable layer, Tis a thickness of the LED chip, Wis a maximum width of LED chip corresponding to the first pattern.

Growing community of inventors

Hsinchu, Taiwan

Wen-Chien Wu