Sensortek Technology Corp.

Wen-Chieh Tsou

Yi-Hua Chang

Chih-Wei Chen

A complex sensing device packaging structure and packaging method are disclosed. The packaging structure includes a substrate disposed with a light emitting element and a light sensing chip. A first non-transparent material is disposed on the light sensing chip. A transparent molding material surrounds the light emitting element, the light sensing chip and the first non-transparent material. A second non-transparent material is disposed inside the transparent molding material, and the second non-transparent material is connected with the first non-transparent material.

Complex sensing device packaging structure and packaging method

A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.

Growing community of inventors

Hsinchu County, Taiwan

Wen-Chieh Tsou