Primax Electronics Ltd.

Wen-Chi Shih

Ying-Chieh Chen

Chien-Nan Yu

Kuang-Che Chen

Ying-Shou Chen

Chung-Feng Tsao

Li-Pen Lin

Hang-Kau Khor

Yu-Hsiao Li

The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.

Method for assembling camera module

An optical image system includes an image pickup module, a swinging mechanism, a first swinging calibration element and a second swinging calibration element. When the optical image system is tilted because of handshaking, the image pickup module is swung by the swinging mechanism. At the same time, the first swinging calibration element and the second swinging calibration element detect whether the image pickup module is swung to an ideal position where the handshaking problem is eliminated.

Optical image system

Growing community of inventors

Taipei, Taiwan

Wen-Chi Shih