Advanced Chip Engineering Technology, Inc.

Wen-Bin Sun

Wen-Kun Yang

Chin-Chen Yang

His-Ying Yuan

Jui-Hsien Chang

Chao-Nan Chou

Chun Hui Yu

Chih-Wei Lin

Shih-Li Chen

Chun-Hui Yu

Kuang-Chi Chao

Cheng-hsien Chiu

Wen-Ping Yang

Hsi-Ying Yuan

Ming-Hui Lin

An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.

Image sensor with a protection layer

A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Method for forming filling paste structure of WL package

Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

FBGA and COB package structure for image sensor

A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.

Package structure

Growing community of inventors

Taipei, Taiwan

Wen-Bin Sun