Shenzhen Longsys Electronics Co., Ltd.

Huawei Technologies Co., Limited

Weiwen Pang

Xiaoqiang Li

Zhixiong Li

Honghui Hu

Jinmou Qin

A test system for a memory card includes a first circuit board. One side of the first circuit board is provided with a plurality of contact groups spaced apart from each other along a row direction. Another side of the first circuit board is provided with slots disposed along the row direction. The test system further includes a second circuit board. The second circuit board is provided with a test circuit, and is inserted into the slot along a direction perpendicular to the first circuit board. The second circuit board provides a test signal to the contact groups.

Test system for memory card

A SSD storage module comprising a printed circuit board, an encapsulating colloid, and an electronic circuit welded on an inner surface of the printed circuit board and having a data storage function; the encapsulating colloid is formed on the inner surface of the printed circuit board and is configured for seamlessly encapsulating the electronic circuit, an outer surface of the printed circuit board is provided with a plurality of metal contact pieces, the plurality of metal contact pieces are electrically connected with the electronic circuit, and the plurality of metal contact pieces comprise a plurality of SATA interface contact pieces. The encapsulating colloid seamlessly encapsulates the electronic circuit and isolates the electronic circuit from the air, such that a problem that the electronic circuit is directly exposed to the air, and performances of components of the electronic circuit may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.

SSD storage module, SSD component, and SSD

A SSD storage module comprising a printed circuit board (), an encapsulating colloid (), and an electronic circuit () welded on an inner surface of the printed circuit board () and having a data storage function; the encapsulating colloid () is formed on the inner surface of the printed circuit board () and is configured for seamlessly encapsulating the electronic circuit (), an outer surface of the printed circuit board () is provided with a plurality of metal contact pieces (), the plurality of metal contact pieces () are electrically connected with the electronic circuit (), and the plurality of metal contact pieces () comprise a plurality of SATA interface contact pieces (). The encapsulating colloid () seamlessly encapsulates the electronic circuit () and isolates the electronic circuit () from the air, such that a problem that the electronic circuit () is directly exposed to the air, and performances of components of the electronic circuit () may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.

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Shenzhen, China

Weiwen Pang