Semitronix Corporation

Weiwei Pan

Yongjun Zheng

Fan Lan

Shenzhi Yang

Zheng Shi

Zhong Tang

Xu Ouyang

Lili Li

Zhenyan Huang

Yongli Liu

A test apparatus for testing electrical parameters of a target chip includes: a function generator; a switch matrix module; a plurality of source measurement units (SMUs); at least one of the SMUs is configured to provide power supply for the target chip; at least one of the SMUs is coupled to the switch matrix module; and at least two of said SMUs are test SMUs coupled to ports of the target chip and the function generator.

Addressable test chip

A temperature sensor includes a NAND gate and a plurality of delay units. The NAND gate includes a first and a second input terminals, and an output terminal. The first input terminal is configured to receive an external starting control signal. The plurality of delay units are connected in series. An input end of the first delay unit is connected to the output terminal of the NAND gate. An output end of the last delay unit is connected to the second input terminal of the NAND gate, thereby forming a ring oscillator structure. The temperature sensor can realize conversion of temperature-leakage-frequency based on the ring oscillator structure in a temperature range of &#x2212;40&#x2dc;125&#xb0; C., thereby simplifying design complexity and achieves high accuracy.

Temperature sensor

Addressable test system with address register

To improve test efficiency of addressable test chips, an addressable test chip test system includes a test equipment, a probe card and an addressable test chip, the test equipment connects to the addressable test chip through the probe card to constitute a test path, the test system includes a new type of address register, which can provide two test modes for users according to user's needs. A new type of high density addressable test chip can accommodate DUTs of more than 1000/mm.

Addressable test chip test system

An addressable ring oscillator test chip includes: a plurality of ring oscillator test units, and a peripheral structure including peripheral circuits and PADs. The peripheral circuits share a first power source and a first grounding. Each test unit is associated with an independent power source to thereby decrease voltage drop resulting from wiring and to reduce the influence from other test units. A method of generating a variety of ring oscillators includes: generating a cell template corresponding to a basic unit, including defining a parameterized cell template; generating a ring oscillator based on the cell template, including generating ring oscillators of different stages by selecting different parameters of the cell template; realizing internal connections of the ring oscillator; and generating an instantiated ring oscillator by replacing cell templates with corresponding basic units.

Addressable ring oscillator test chip

An addressable test circuit is configured to test parameters of a plurality of transistors. The addressable test circuit includes combination logic circuits including a plurality of gate circuits and are configured to select a device under test, a plurality of PADs, a plurality of address bus and data bus; wherein six or more of the data buses are test signal lines. A test method can employ the above address test circuit for testing parameters of a plurality of transistors, where the subthreshold leakage current Iand saturation current Iare measured in different signal lines respectively to ensure the accurate measurement of the two parameters in one circuit.

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Hangzhou, China

Weiwei Pan