Quantum Corporation

Weiting Lee

Sin-Siang Wang

Gang-Lin Zhang

Meng-Hua Tsai

Kun Yen Tu

A three-dimensional (3D) filter and a fabrication method thereof are provided. The 3D filter includes a circuit board, a first ring resonator, a second ring resonator and a via structure. The circuit board includes a first circuit layer, a second circuit layer and a third circuit layer. The third circuit layer is located between the first circuit board and the second circuit board. The first ring resonator is disposed in the first circuit layer and has a first ring surrounded area corresponding to a first cut-off frequency band. The second ring resonator is disposed in the second circuit layer and has a second ring surrounded area corresponding to a second cut-off frequency band. The via structure passes through the first circuit layer, the second circuit layer and the third circuit layer, and is electrically connected to the first ring resonator and the second ring resonator.

3D filter and fabrication method thereof

A multi-band filter includes a circuit board, a first resonator, a second resonator, and a coupling element configured to couple the first resonator with the second resonator. The coupling element includes a first coupling capacitor, a second coupling capacitor, a first short-circuited stub and a second short-circuited stub. The first coupling capacitor has two terminals electrically connected to the first portion of the first resonator and the first portion of the second resonator respectively. The second coupling capacitor has two terminals electrically connected to the second portion of the first resonator and the second portion of the second resonator respectively. The first short-circuited stub is electrically connected to the first coupling capacitor and a ground plane. The second short-circuited stub is electrically connected to the second coupling capacitor and a ground plane.

Multi-band filter

An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.

Antenna structure and antenna array structure

An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member and a plurality of conductive vias. The substrate contains liquid crystal polymer and has opposite first and second surfaces. The reflective plates are arranged in an array on the first surface of the substrate. The grounding plate is arranged on the second surface of the substrate and overlaps with the reflective plates in a normal direction of the substrate. The radiating member is on the second surface of the substrate and does not overlap with the reflective plates in the normal direction of the substrate. The radiating member has an open slot which is defined by a first radiating branch and a second radiating branch that generate at least two different operating frequency bands. The conductive vias respectively penetrate the substrate and connect with the reflective plates and the grounding plate.

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Kaohsiung, Taiwan

Weiting Lee