Broadcom Corporation

Adeia Semiconductor Bonding Technologies Inc.

Vertical Circuits, Inc.

Other

Weiping Pan

Scott P McGrath

Simon J S McElrea

Scott Jay Crane

DeAnn Eileen Melcher

Reynaldo Co

Grant Villavicencio

Marc E Robinson

Wenqing Jiang

Terrence Caskey

Zongrong Liu

Lawrence Douglas Andrews, Jr

Yong Du

De Ann Eileen Melcher

Paul Yang Lu

Li Hao

Ying Cao

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Semiconductor die mount by conformal die coating

Techniques for performing rate control for encoding of video frames are provided. A first timestamp that indicates a prior video frame capture time and a second timestamp that indicates a current video frame capture time are received. A time difference between these timestamps is determined. An average video data bit encoding rate is multiplied by the determined time difference to calculate a bit budget. An indication of a number of encoded video data bits of the prior video frame and of any further video frames encoded subsequent to the prior video frame and prior to the current video frame is received. A virtual buffer fill level is adjusted based on a difference between the indicated number of encoded video bits and the calculated bit budget. A quantizer parameter is adjusted based on the adjusted virtual buffer fill level. The current video frame is encoded according to the adjusted quantizer parameter.

Adaptive rate control for encoding of variable frame rate video sources

According to the invention, die shift is reduced or substantially eliminated, by cutting the wafer in two stages. In some embodiments a first wafer cutting procedure is carried out prior to thinning the wafer to the prescribed die thickness; and in other embodiments the wafer is thinned to the prescribed die thickness prior to carrying out a first wafer cutting procedure. The first wafer cutting procedure includes cutting along a first set of streets to a depth greater than the prescribed die thickness and optionally along a second set of streets to a depth less than the die thickness. The result of the first cutting procedure is an array of strips or blocks of die, each including a plurality of connected die, that are less subject to shift than are individual singulated die. In a second wafer cutting procedure the die are singulated by cutting through along the second set of streets. Subsequent to the first cutting procedure, and prior to the second cutting procedure, additional die preparation procedures that are sensitive to die shift may be carried out.

Semiconductor die array structure

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

Wafer level surface passivation of stackable integrated circuit chips

Methods and systems for processing video data are provided herein. Aspects of the method may comprise receiving on a chip, a plurality of video frames and storing a portion of the received video frames in a memory on the chip. A first portion of the stored video frames may be decoded on the chip and a second portion of the stored video frames may be encoded on the chip during the decoding. A third portion of the stored video frames may be converted from an input video format to a YUV video format. A reference frame corresponding to the converted third portion may be identified from the stored video frames. After conversion, the converted third portion of the received video frames may be utilized as the reference frame for estimating/encoding, or compensating/decoding temporal motion of the subsequently received video frames.

Method and system for image processing in a microprocessor for portable video communication devices

Methods, systems, and apparatuses for performing rate control for encoding of video frames are provided. A first timestamp is received that indicates a capture time for a prior video frame. A second timestamp is received that indicates a capture time for a current video frame. A time difference between the second timestamp and the first timestamp is determined. An average video data bit encoding rate is multiplied by the determined time difference to calculate a bit budget. An indication of a number of video data bits that have been encoded is received. The number includes a number of encoded video data bits of the prior video frame and of any further video frames encoded subsequent to the prior video frame and prior to the current video frame. A virtual buffer fill level is adjusted based on a difference between the indicated number of video bits that have been encoded and the calculated bit budget. A quantizer parameter is adjusted based on the adjusted virtual buffer fill level. The current video frame is encoded according to the adjusted quantizer parameter.

Methods, systems, and apparatuses for averaging data in packed format are provided. The data may be image data, such as data words containing color-specific data portions representative of pixels of a captured image. A first data word containing first image data is received. A second data word containing second image data is received. A logical AND of the first data word and the second data word is performed to generate a third data word. A logical exclusive OR (XOR) of the first data word and the second data word is performed to generate a fourth data word. A right shift of the fourth data word is performed. The third data word and the right shifted fourth data word are summed to generate a fifth data word that is an average of the first and second data words.

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Weiping Pan