International Rectifier Corporation

Weiping Hu

Weidong Zhuang

David Scott Doiron

Michael McGonigle

A sealed semiconductor power module that may include a rectifier, such as a silicon controlled rectifier (SCR), is provided. The module includes an AlN substrate having a bottom surface positioned on a metallic base plate and a top surface that includes a first pad and a second pad, the substrate including a copper body on both of the two major surfaces. The module also includes a first die and a second die positioned on top of the first and second pads, respectively, the first die and the second die each including a main contact area on a top surface thereof, the first die including an isolated gate area on the top surface to which is coupled a gate terminal; and first and second power terminals in direct wirebondless electrical connection via molybdenum tabs with the main contact areas of the die.

Hermetically sealed semiconductor device module

A module which includes a hermetically sealed housing and a terminal block which is integrated with the hermetically sealed housing to provide electrical connection to external devices.

Growing community of inventors

Westford, MA, United States of America

Weiping Hu