Au Optronics Corporation

Ememory Technology Inc.

Wein-Town Sun

Wei-Ren Chen

Chia-Jung Hsu

Ying-Je Chen

Jian-Shen Yu

Hsueh-Wei Chen

Chun-Hsiao Li

Chun-Sheng Li

Chun-Yuan Lo

Wei-Ming Ku

Yu-Hsiung Tsai

Jung-Chun Tseng

Jen-Yi Hu

Woan-Yun Hsiao

Shang-Wei Fang

Jui-Ming Kuo

Cheng-Jye Liu

Chien-Chih Chen

Shin-Hung Yeh

Ching-Yuan Lin

Yun-Jen Ting

Hong-Yi Liao

Yuan-Tai Lin

Kai-Yuan Hsiao

Chao-Wei Kuo

Ming-Dou Ker

Ching-Hsiang Hsu

Hung-Wei Tseng

Shi-Hsiang Lu

Chun-Hung Kuo

Chih-Kang Deng

Hung-Yi Liao

Cheng-Yen Shen

Chee-Seng Tan

Wen-Yuan Lee

Sheng-Kai Peng

Ling-Chang Hu

A differential memory cell array structure for a MTP non-volatile memory is provided. The array structure is connected to a source line, a word line, a bit line, an inverted bit liner and an erase line. After an erase operation (ERS) is completed, the stored data in the differential memory cells of the selected row are not all erased. That is, only the stored data in a single selected memory cell of the selected row is erased.

Differential memory cell array structure for multi-time programming non-volatile memory

A memory cell of a charge-trapping non-volatile memory includes a semiconductor substrate, a well region, a first doped region, a second doped region, a gate structure, a protecting layer, a charge trapping layer, a dielectric layer, a first conducting line and a second conducting line. The first doped region and the second doped region are formed under a surface of the well region. The gate structure is formed over the surface of the well region. The protecting layer formed on the surface of the well region. The charge trapping layer covers the surface of the well region, the gate structure and the protecting layer. The dielectric layer covers the charge trapping layer. The first conducting line is connected with the first doped region. The second conducting line is connected with the second doped region.

Memory cell of charge-trapping non-volatile memory

A memory cell of a non-volatile memory includes a memory element. The memory element is a transistor. The memory element includes an asymmetric spacer. In the memory element, a channel under the wider part of the spacer is longer. When the program operation of the memory element is performed, more carriers are injected into a charge-trapping layer of the spacer through the longer channel. Consequently, the program operation of the memory element is performed more efficiently, and the time period of performing the program operation is reduced.

Memory cell of non-volatile memory

An erasable programmable single-poly non-volatile memory cell and an associated array structure are provided. In the memory cell of the array structure, the assist gate region is composed at least two plate capacitors. Especially, the assist gate region at least contains a poly/poly plate capacitor and a metal/poly plate capacitor. The structures and the fabricating processes of the plate capacitors are simple. In addition, the uses of the plate capacitors can effectively reduce the size of the memory cell.

Erasable programmable single-poly non-volatile memory cell and associated array structure

A memory structure including a substrate, a gate structure, a charge storage layer, and a first control gate is provided. The substrate has a fin portion. A portion of the gate structure is disposed on the fin portion. The gate structure and the fin portion are electrically insulated from each other. The charge storage layer is coupled the gate structure. The charge storage layer and the gate structure are electrically insulated from each other. The first control gate is coupled to the charge storage layer. The first control gate and the charge storage layer are electrically insulated from each other.

Memory structure and operation method thereof

A method for manufacturing a semiconductor structure includes forming a first oxide layer on a wafer; forming a silicon nitride layer on the first oxide layer; forming a plurality of trenches; filling an oxide material in the trenches to form a plurality of shallow trench isolation regions; removing the silicon nitride layer without removing the first oxide layer; using a photomask to apply a photoresist for covering a first part of the first oxide layer on a first area and exposing a second part of the first oxide layer on a second area; and removing the second part of the first oxide layer while remaining the first part of the first oxide layer.

Method for manufacturing semiconductor structure and capable of controlling thicknesses of oxide layers

A one time programmable non-volatile memory cell includes a storage element. The storage element includes a glass substrate, a buffer layer, a polysilicon layer and a metal layer. The buffer layer is disposed on the glass substrate. The polysilicon layer is disposed on the buffer layer. A P-type doped region and an N-type doped region are formed in the polysilicon layer. The metal layer is contacted with the N-type doped region and the P-type doped region. The metal layer, the N-type doped region and the P-type doped region are collaboratively formed as a diode. When a program action is performed, the first diode is reverse-biased, and the diode is switched from a first storage state to a second storage state. When a read action is performed, the diode is reverse-biased and the diode generates a read current.

One time programmable non-volatile memory cell on glass substrate

A memory device includes a well, a poly layer, a dielectric layer, an alignment layer and an active area. The poly layer is formed above the well. The dielectric layer is formed above the poly layer. The alignment layer is formed on the dielectric layer, used to receive an alignment layer voltage and substantially aligned with the dielectric layer in a projection direction. The active area is formed on the well. The dielectric layer is thicker than the alignment layer. A first overlap area of the poly layer and the active area is smaller than a second overlap area of the poly layer and the dielectric layer excluding the first overlap area.

Memory device and method for operating memory device

A read-only memory cell array includes a first storage state memory cell and a second storage state memory cell. The first storage state memory cell includes a first transistor and a second transistor. The first transistor is connected to a source line and a word line. The second transistor is connected to the first transistor and a first bit line. The second storage state memory cell includes a third transistor and a fourth transistor. The third transistor is connected to the source line and the word line. The fourth transistor is connected to the third transistor and a second bit line. A gate terminal of the fourth transistor is connected to a gate terminal of the third transistor.

Read-only memory cell and associated memory cell array

A memory cell of a memory cell array includes a well region, a first doped region, a second doped region, a first gate structure, and a storage structure. The first doped region and the second doped region are formed in the well region. The first gate structure is formed over a first surface between the first doped region and the second doped region. The storage structure is formed over a second surface and the second surface is between the first surface and the second doped region. The storage structure is covered on a portion of the first gate structure, the second surface and an isolation structure.

Memory cell array of programmable non-volatile memory

A memory device includes a well, a first gate layer, a second gate layer, a doped region, a blocking layer and an alignment layer. The first gate layer is formed on the well. The second gate layer is formed on the well. The doped region is formed within the well and located between the first gate layer and the second gate layer. The blocking layer is formed to cover the first gate layer, the first doped region and a part of the second gate layer and used to block electrons from excessively escaping. The alignment layer is formed on the blocking layer and above the first gate layer, the doped region and the part of the second gate layer. The alignment layer is thinner than the blocking layer, and the alignment layer is thinner than the first gate layer and the second gate layer.

Memory device including alignment layer and semiconductor process method thereof

A memory device includes a first well, a second well, a first active area, a second active area, a third active area, a first poly layer and a second poly layer. The first well is of a first conductivity type. The second well is of a second conductivity type different from the first conductivity type. The first active area is of the second conductivity type and is formed on the first well. The second active area is of the first conductivity type and is formed on the first well and between the first active area and the second well. The third active area is of the first conductivity type and is formed on the second well. The first poly layer is formed above the first well and the second well. The second poly layer is formed above the first well.

Memory device capable of improving erase and program efficiency

An erasable programmable non-volatile memory includes a first-type well region, three doped regions, two gate structures, a blocking layer and an erase line. The first doped region is connected with a source line. The third doped region is connected with a bit line. The first gate structure is spanned over an area between the first doped region and the second doped region. A first polysilicon gate of the first gate structure is connected with a select gate line. The second gate structure is spanned over an area between the second doped region and the third doped region. The second gate structure includes a floating gate and the floating gate is covered by the blocking layer. The erase line is contacted with the blocking layer. The erase line is located above an edge or a corner of the floating gate.

Erasable programmable non-volatile memory

An erasable programmable non-volatile memory includes a first select transistor, a first floating gate transistor, a second select transistor and a second floating gate transistor. A select gate and a first source/drain terminal of the first select transistor receive a first select gate voltage and a first source line voltage, respectively. A first source/drain terminal and a second source/drain terminal of the first floating gate transistor are connected with a second source/drain terminal of the first select transistor and a first bit line voltage, respectively. A select gate and a first source/drain terminal of the second select transistor receive a second select gate voltage and a second source line voltage, respectively. A first source/drain terminal and a second source/drain terminal of the second floating gate transistor are connected with the second source/drain terminal of the second select transistor and a second bit line voltage, respectively.

Growing community of inventors

Hsinchu County, Taiwan

Wein-Town Sun