Intel Corporation

Weimin Shi

Tanay Karnik

Gerhard Schrom

Edward Allyn Burton

Peter Hazucha

Jeffory L Smalley

Michael J Hill

Zane A Ball

Trang T Nguyen

Brian D Aspnes

Mary Bloechel, Legal Representative

Apparatuses and systems associated with power provision for packages mounted to a printed circuit board are disclosed herein. In embodiments, a socket arrangement may include a header and a first bus bar, wherein the first bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a power supply contact of a component package and to a power supply connection within a proximity of a power source, wherein a power output of the power source is electrically coupled to the power supply connection. The socket arrangement may further include a second bus bar, wherein the second bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a ground contact of the component package and a ground connection within the proximity of the power source. Other embodiments may be described and/or claimed.

Power bar package mount arrangement

A multi-phase transformer is provided that includes a first layer having at least a first planar wire and a second planar wire and a second layer formed on the first layer and having at least a third planar wire and a fourth planar wires. At least the first planar wire and the second planar wire of the first layer to form two transformers with at least two planar wires of the second layer. The multi-phase transformer may also include a coupling device to couple one end of the planar wires of the first layer with one of the planar wires of the second layer.

Power transformer

Reduce breakdown voltage and control breakdown path for electrostatic discharge to terminals of microelectronic packages, such as no-connect Land Grid Array (LGA) pads. In one embodiment, solder resist openings with a small separation distance are used to provide an air breakdown path between a no-connect LGA pad and the surrounding metal and to reduce the breakdown voltage. In one implementation, the no-connect pad has a non-round shape with a protruding portion on the dielectric layer. The air surrounding a solder resist opening over the tip of the protruding portion of the no-connect pad and a nearby solder resist opening over the surrounding metal provides a shortest air breakdown path and the lowest breakdown voltage. Alternatively, sharp features (e.g., metal traces) with a minimum separation distance can be arranged pointing at each other under the solder resist layer, or other dielectric layer inside the package, to provide a non-exposed breakdown path.

Control of breakdown voltage for microelectronic packaging

An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.

High performance microprocessor power delivery solution using flex connections

Growing community of inventors

Portland, OR, United States of America

Weimin Shi