Amkor Technology Singapore Holding Pte. Ltd.

Weilung Lu

Adrian Arcedera

Shingo Nakamura

Burt Barber

Sang Jae Jang

In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein.

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Chandler, AZ, United States of America

Weilung Lu