Dowa Metaltech Co., Ltd.

Weilin Gao

Akira Sugawara

Hisashi Suda

Hiroto Narieda

Takashi Kimura

Fumiaki Sasaki

Toshiya Kamada

Ryosuke Miyahara

Motohiko Suzuki

Tomotsugu Aoyama

Akifumi Onodera

Hisahi Suda

A copper alloy sheet material comprises (by mass %) from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM, from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles (particle diameter of 5 mm or more) is 10 per mmor less. A number density of fine secondary phase particles (particle diameter of from 5 to 10 nm) is 1.0&#xb7;10per mmor more. A Si concentration in the parent phase is 0.10% by mass or more.

High strength Cu&#x2014;Ni&#x2014;Co&#x2014;Si based copper alloy sheet material and method for producing the same, and current carrying component

A sheet material of a copper alloy has a chemical composition comprising 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 &#x3bc;m and (maximum crystal grain size&#x2212;minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, assuming that the maximum, minimum and mean values of mean values, each of which is the mean value of crystal grain sizes in a corresponding one of a plurality of regions which are selected from the surface of the sheet material at random and which have the same shape and size, are the maximum, minimum and mean crystal grain sizes, respectively, and the material having a crystal orientation satisfying I{420}/I{420}&#x3e;1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I{420}, respectively.

Copper alloy plate and method for producing same

A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I{200}&#x2265;1.0, assuming that the intensity of X-ray diffraction on the {200} crystal plane on the surface of the copper alloy sheet is I{200} and that the intensity of X-ray diffraction on the {200} crystal plane of the standard powder of pure copper is I{200}, and which satisfies I{200}/I{422}&#x2265;15, assuming that the intensity of X-ray diffraction on the {422} crystal plane on the surface of the copper alloy sheet is I{422}.

Copper alloy sheet and method for producing same

Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800&#xb0; C. to 1020&#xb0; C.; first quenching to 500&#xb0; C. to 800&#xb0; C.; maintaining the 500&#xb0; C. to 800&#xb0; C. temperature for 10 seconds to 600 seconds; and second quenching to 300&#xb0; C. or lower.

Manufacturing method of copper alloy sheet

A Cu&#x2014;Ni&#x2014;Co&#x2014;Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0&#xd7;10number/mmor more. A number density of fine second phase particles is not more than 5.0&#xd7;10number/mm. A number density of coarse second phase particles is 1.0&#xd7;10number/mmor more and not more than 1.0&#xd7;10number/mm. The material has crystal orientation satisfying the following equation (1):{200}/{200}&#x2267;3.0&#x2003;&#x2003;(1)wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.

Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same

A Cu&#x2014;Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 10number/mm.

Cu&#x2014;Ti based copper alloy sheet material and method for producing the same, and electric current carrying component

This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1):{420}/{420}&#x3e;1.0&#x2003;&#x2003;(1),

Cu&#x2014;Ni&#x2014;Si-based copper alloy sheet material and method of manufacturing same

There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.

Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component

A sheet material of a copper alloy has a chemical composition including 1.2 to 5.0 wt % of titanium, and the balance being copper and unavoidable impurities, the material having a mean crystal grain size of 5 to 25 &#x3bc;m and (maximum crystal grain size&#x2212;minimum crystal grain size)/(mean crystal grain size) being 0.20 or less, and the material having a crystal orientation satisfying I{420}/I{420}&#x3e;1.0, assuming that the intensities of X-ray diffraction on the {420} crystal plane of the surface of the material and the standard powder of pure copper are I{420} and I{420}, respectively.

Provided is a Cu&#x2014;Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 &#x3bc;m.{420}/{420}&#x3e;1.0&#x2003;&#x2003;(1){220}/{220}&#x2266;3.0&#x2003;&#x2003;(2)

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Tokyo, Japan

Weilin Gao