Sandisk Semiconductor (shanghai) Co. Ltd.

Sandisk Technologies Inc.

Western Digital Technologies, Inc.

Sandisk Information Technology (shanghai) Co., Ltd.

Tiger New Surface Materials (suzhou) Co., Ltd.

Sunman (shanghai) Co., Ltd.

Sunman (hong Kong) Limited

Sunman (zhenjiang) Co., Ltd.

Weili Wang

Junrong Yan

Li Ping Wang

Chin-Tien Chiu

Chee Keong Chin

Kim Lee Bock

Xin Lu

King Hoo Ong

Guozhu Long

Jiaoyan Liu

Chengrong Lian

Ning Ye

Cheeman Yu

Suresh Kumar Upadhyayula

Zhong Lu

Cong Zhang

Peng Lu

Jack Chang Chien

Zhengrong Shi

Xin Hua Tian

Xiaofeng Di

Chong Un Tan

Qi Deng

Yang Lei

CheeKeong Chin

Peng Fu

Yuang Zhang

Enyong Tai

Pradeep Rai

Zhicheng Wang

Hang Zhang

Chaur Yang Ng

Chenlin Yang

Tianhe Dai

Xin Tian

Biao Luo

Pradeep Kumar Rai

Jianbin Gu

XingZhi Liang

Shicai Ma

Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may then be supported on a vacuum chuck without using a dicing tape, and dies transferred from the wafer using a pick and place robot.

Semiconductor device with reduced stress die pick and place

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Semiconductor device including vertical wire bonds

An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.

Encapsulant material for photovoltaic modules and method of preparing the same

A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.

Photovoltaic assembly

A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.

Semiconductor device including corner recess

A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.

Spacer layer for embedding semiconductor die

A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

System for separating a diced semiconductor die from a die attach tape

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Shanghai, China

Weili Wang