Walsin Lihwa Corporation

Tsinghua University

Other

Computed Ultrasound Global Corporation

Weileun Fang

Hung-Yi Lin

Hsueh-An Yang

Jerwei Hsieh

Mingching Wu

Julius Ming-Lin Tsai

Huai-Yuan Chu

Wen-Chih Chen

Yen-Chung Chang

Sheng-Yi Hsiao

Wei-Cheng Lai

Chih-Chun Lee

Chun-Kai Chan

Chia-Pao Hsu

Hsi-Wen Tung

Ming-Ching Wu

Wen Pin Lai

Jiunn-Horng Lee

Sheng-Kai Yeh

Tsung-Lin Tang

Yu-Tao Lee

Migching Wu

Sz-Yuan Lee

The present invention provides a micro tactility-simulating sensing device, including: a chip including a first top surface and a first inductor, wherein the first top surface has wiring through holes configured to allow an external circuit to connect to the first inductor, and the first top surface is a flat surface except the wiring through holes; a magnetic rigid body coupled with the first inductor to allow the first inductor to sense a magnetic flux passing therethrough, and configured to receive a tactile load; and a polymer configured between the chip and the magnetic rigid body to have a characteristic distance therebetween, wherein the characteristic distance and the magnetic flux have a functional relationship. The micro tactility-simulating sensing device of the present invention can effectively increase the magnitude of the measured signal and provide two different ways to read the signal.

Micro tactility-simulating sensing device and method for producing the device

A method for manufacturing a micro normally-closed structure. The method includes steps of providing a flexible arm, and a stationary base and a fixed contact separated from the flexible arm, wherein the flexible arm is free to move and includes a first end configured at one terminal and a movable contact configured at another terminal, the transient base is configured at where corresponds to the first end, and the fixed contact is configured at where corresponds to the movable contact; forming a temporary electrical connection between the first end and the stationary base; forming a temporary electrical conduction between the movable contact and the fixed contact; maintaining the temporary electrical connection and the temporary electrical conduction; and securing the first end to the stationary base permanently which causes the temporary electrical connection turn into a permanent electrical connection and the temporary electrical conduction turn into the micro normally-closed structure.

Micro normally-closed structure and method for manufacturing the same

Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits. (1) The sensitivity of the accelerometer is improved since the proof-mass is increased by containing both device and handling silicon layers; (2) The sensitivity is also improved by the gap-closing differential capacitive sensing electrodes design; (3) The parasitic capacitance at bond pad is reduced by the existing of metal-vias between the device Si layer and handling Si layer; (4) The sensing gap thickness is precisely defined by the buried oxide of SOI wafer; (5) The stationary sensing electrodes anchored to the substrate also act as the limit stops to protect the accelerometer.

3-axis accelerometer with gap-closing capacitive electrodes

The present invention discloses an MEMS capacitive microphone including a rigid diaphragm arranged on an elastic element. When a sound wave acts on the rigid diaphragm, the rigid diaphragm is moved parallel to a normal of a back plate by elasticity of the elastic element. Thereby the variation of the capacitance is obtained between the rigid diaphragm and the back plate.

MEMS capacitive microphone

A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.

Integration manufacturing process for MEMS device

A magnetic element and its manufacturing method are provided. A magnetic element includes an actuation part having a first surface and a second surface, a torsion bar connected to the actuation part, and a frame connected to the first torsion bar, wherein the first surface of the actuation part is an uneven surface. The manufacturing method of the magnetic element starts with forming an passivation layer on a substrate and defining a special area by the mask method, then continues with forming the adhesion layer and electroplate-initializing layer on the substrate sequentially. The photoresist layer are formed and the magnetic-inductive material is electroformed on the electroplate area. Finally, the substrate is etched and the passivation layer is removed to obtain the magnetic element. The manufacturing method of magnetic element of the present invention can be applied in the microelectromechanical system field and other categories.

Magnetic element and manufacturing method therefor

The present invention discloses a method for assembling a 3D microelectrode structure. Firstly, 2D microelectrode arrays are stacked to form a 3D microelectrode array via an auxiliary tool. Then, the 3D microelectrode array is assembled to a carrier chip to form a 3D microelectrode structure. The present invention uses an identical auxiliary tool to assemble various types of 2D microelectrode arrays having different shapes of probes to the same carrier chip. Therefore, the method of the present invention increases the design flexibility of probes. The present invention also discloses a 3D microelectrode structure, which is fabricated according to the method of the present invention and used to perform 3D measurement of biological tissues.

Method for assembling a 3-dimensional microelectrode structure

A method of manufacturing an optical component is provided. The method comprises steps of providing a first liquid; providing a fluid, disposed above the first liquid, wherein an interface exists between the first liquid and the fluid; providing a polymer precursor at the interface; and solidifying the polymer precursor so as to form the optical component made by a polymer.

Method of manufacturing optical components

A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.

Solid tunable micro optical device and method

A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom portion of the lateral strengthening structure, and a part of the substrate by an etching process so as to form a lower structure and expose an unstrengthened structure; and (f) etching the unstrengthened structure laterally so as to form an upper structure.

Selective etching method

A two-axis device is provided. The two-axis device includes a first substrate having a plurality of electrodes, a first connecting layer located on the first substrate, an actuating layer, a second connecting layer and a cover. The actuating layer is connected to the first substrate via the first connecting layer and includes a circular portion, an actuating portion, a first shaft and a second shaft. The second connecting layer is connected to the actuating layer and the cover is connected to the actuating layer via the second connecting layer. In addition, a vacuum concavity is formed by the first substrate, the first connecting layer, the actuating layer, the second connecting layer and the cover. The actuating portion and the first shaft are located in the vacuum concavity, and the second shaft extends outside of the vacuum concavity.

Two-axis device and manufacturing method therefor

A corner-compensation method for fabricating MEMS (Micro-Electro-Mechanical System) is provided. The method includes steps of: (a) providing a substrate; (b) forming a conductive layer on the substrate; (c) sequentially forming a masking layer having structural openings and a photoresist layer on the conductive layer; (d) executing a photolithography for etching the photoresist layer and the masking layer to form at least one hole penetrating the photoresist layer and the masking layer; (e) etching the conductive layer and the substrate to extend the at least one hole to upper portions of the substrate; (f) removing the photoresist layer and etching the conductive layer and the substrate via the structural openings and the at least one hole respectively to form deep trench structures having different depths; (g) forming a peripheral compensation structure on a side-wall portion of the deep trench structure having the different depths; (h) removing portions of the peripheral compensation structure laterally and the substrate for exposing an uncompensated silicon structure; and (i) side etching the uncompensated silicon structure to be terminated by the peripheral compensation structure around the at least one hole.

Corner compensation method for fabricating MEMS and structure thereof

A high-aspect-ratio-microstructure (HARM) is provided. The structure includes: a substrate; a lower structure with a comb shape fixedly mounted on said substrate and having first plural comb fingers, wherein each of the first plural comb fingers has a thin slot thereon; an upper structure with a comb shape having second plural comb fingers, wherein the lower structure and the upper structure have a height difference therebetween so as to form an uneven surface; and a lateral strengthening structure formed at vertically peripheral walls of the first plural comb fingers and the second plural comb fingers for protecting the plural first and second comb fingers.

Growing community of inventors

Hsinchu, Taiwan

Weileun Fang