Corning Incorporated

Weijun Niu

Mingqian He

Arthur Lawrence Wallace

David Neal Schissel

James Robert Matthews

Kevin Robert McCarthy

Dana Craig Bookbinder

Adama Tandia

Thomas Mark Leslie

Huayun Deng

Jieyu Hu

Robert Alan Bellman

Michael James Winningham

Timothy Edward Myers

Kristi Lynn Simonton

Richard Allen Hayes

Lei Zhang

Michelle Dawn Fabian

Yunfeng Gu

Frederic Christian Wagner

Rui Zhang

Jianfeng Li

Ming-Jun Li

Pushkar Tandon

Scott Robertson Bickham

Shandon Dee Hart

Govindarajan Natarajan

Yuhui Jin

Fei Li

David L Weidman

Jian Luo

Curtis Robert Fekety

Zheming Zheng

Michael Edward DeRosa

Michael Lesley Sorensen

Patrick Jean

Wei Sun

Joseph Edward McCarthy

Karan Mehrotra

Matthew Daniel Trosa

Jen-Chieh Lin

Clemens Rudolf Horn

Jinfa Mou

Hongxiang Wang

Brian Paul Usiak

Melanie Lian Geiger

Therese Francoise Arliguie

Matthew Ryan Drake

Deqiu Fan

Louis Charles Glasgow

Methods of cleaning glass comprise mixing the glass with a peroxide-containing aqueous solution and heating the glass at a temperature of about 100° C. or more. In aspects, 50 wt % of the peroxide-containing aqueous solution based on an amount of the glass is mixed with the glass. The peroxide-containing aqueous solution can be removed from the glass before the heating. Alternatively, in aspects, from 10 wt % to 50 wt % of the peroxide-containing aqueous solution based on an amount of the glass can be mixed with the glass.

Methods of cleaning glass

Glass-based substrates are described herein that may be processed by methods including applying a cover article onto a glass-based substrate, submerging the glass-based substrate in an etchant, and maintaining the submersion of the glass-based substrate in the etchant. The glass-based substrate may include a covered surface portion and an exposed surface portion. At least a portion of the covered surface portion may be in direct contact with the cover article. The covered surface portion may not be in contact with the etchant and the exposed surface portion may be in direct contact with the etchant. The etchant may contact the exposed surface portion and the cover article fora time sufficient to etch the exposed surface portion. The cover article may provide a barrier between the etchant and the covered surface portion for the entirety of the submerging.

Methods for etching glass-based substrates

A cross-bred organic semiconductor (OSC) polymer, includes a diketopyrrolopyrrole (DPP)-fused thiophene polymeric material, such that: the DPP-fused thiophene polymeric material comprises a first linear alkyl-substituted DPP portion and a second branched alkyl-substituted DPP portion, the cross-bred OSC polymer comprises a repeat unit having both the first linear alkyl-substituted DPP portion and the second branched alkyl-substituted DPP portion, and the fused thiophene is beta-substituted.

UV patternable polymer blends for organic thin-film transistors

An optical fiber is provided that includes a core region, a cladding region having a radius less than about 62.5 microns; a polymer coating comprising a high-modulus layer and a low-modulus layer, wherein a thickness of the low-modulus inner coating layer is in a range of 4 microns to 20 microns, the modulus of the low-modulus inner coating layer is less than or equal to about 0.35 MPa, a thickness of the high-modulus coating layer is in a range of 4 microns to 20 microns, the modulus of the high-modulus inner coating layer is greater than or equal to about 1.6 GPa, and wherein a puncture resistance of the optical fiber is greater than 20 g, and wherein a microbend attenuation penalty of the optical fiber is less than 0.03 dB/km, and wherein an outer diameter of the coated optical fiber is less than or equal to 175 microns.

Single-mode optical fiber with thin coating for high density cables and interconnects

The present disclosure is directed to pharmaceutical packages that include a coating that comprises polysilazane, and methods for the production of such. In one or more embodiments of the present disclosure, a pharmaceutical package may include a glass container comprising a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The pharmaceutical package may further include a coating positioned over at least a portion of the first surface of the glass container. The coating may include polysilazane.

Pharmaceutical packages with coatings comprising polysilazane

Glass-based articles comprise high effective fracture toughness. Glass-based articles comprise: a glass-based substrate comprising opposing first and second surfaces defining a substrate thickness (t), a substantially planar central portion, and a perimeter portion; a polymer coating disposed on at least a portion of at least one of the first or the second surfaces; and an effective fracture toughness that is greater than or equal to 1.25 MPa&#xb7;mas measured at room temperature.

Coated glasses with high effective fracture toughness

Methods for producing a glass sheet are provided. The methods can include forming a glass ribbon from molten glass, applying a polymer precursor to at least a portion of a first or second major surface of the glass ribbon, curing the polymer precursor to form a polymer coating, and separating the glass ribbon to produce at least one glass sheet. Glass ribbons and glass sheets produced by these methods are also disclosed.

Method for increasing fracture toughness of glass ribbons

Disclosed is a polymer blend comprising an organic semiconductor (OSC) polymer blended with an isolating polymer and method for making the same. The OSC polymer includes a diketopyrrolopyrrole fused thiophene polymeric material, and the fused thiophene is beta-substituted. The isolating polymer includes a non-conjugated backbone, and the isolating polymer may be one of polyacrylonitrile, alkyl substituted polyacrylonitrile, polystyrene, polysulfonate, polycarbonate, an elastomer block copolymer, derivatives thereof, copolymers thereof and mixtures thereof. The method includes blending the OSC polymer with an isolating polymer in an organic solvent to create a polymer blend and depositing a thin film of the polymer blend over a substrate. Also disclosed is an organic semiconductor device that includes a thin semiconducting film comprising OSC polymer.

Doping of other polymers into organic semi-conducting polymers

According to one or more embodiments disclosed herein, a coated glass article may be made by a method that includes applying a water-based coating mixture onto at least a portion of a first surface of a glass article, and heating the water-based coating mixture to form a coating on the first surface of the glass article, where the coating includes metal oxide and polymer. The water-based coating mixture may include comprise water in an amount of at least 50% by weight of the water-based coating mixture, a polymer or polymer precursor, and a metal oxide precursor. The polymer or polymer precursor may be miscible in the water or may form an emulsion with the water. The metal oxide precursor may be miscible in the water or may form an emulsion with the water.

Methods for making coated glass articles such as coated glass containers

Compositions are included comprising heterocyclic organic compounds based on fused thiophene compounds, polymers based on fused thiophene compounds, and methods for making the monomers and polymer along with uses in thin film-based and other devices.

Semiconducting co-polymers of methylenedihydropyrazines with fused thiophenes

Described herein are compositions including heterocyclic organic compounds. More specifically, described herein are bicyclic thiadiazole-based compounds that are combined with fused thiophenes structures, along with methods for making such compounds, and uses thereof.

Fused thiophene-arylthiadiazole polymers, methods of making such polymers, and uses thereof

Articles utilizing polymeric dielectric materials for gate dielectrics and insulator materials are provided along with methods for making the articles. The articles are useful in electronics-based devices that utilize organic thin film transistors.

Photo-patternable gate dielectrics for OFET

Described herein are heterocyclic organic compounds. More specifically, described herein are compounds based on the combination of fused pyrrole structures with diketopyrrolopyrrole structures, methods for making these compounds, and uses thereof. The compounds disclosed have improved electronic, polymerization and stability properties that allow for improved material processibility and inclusion in organic semiconductor devices.

Dihydropyrrolo[2,3-F] indole-diketopyrrolopyrrole semiconducting materials, and methods and uses thereof

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Painted Post, NY, United States of America

Weijun Niu