Canon Kabushiki Kaisha

Molecular Imprints, Inc.

Canon Nanotechnologies, Inc.

Weijun Liu

Niyaz Khusnatdinov

Sidlgata V Sreenivasan

Byung-Jin Choi

Fen Wan

Timothy Brian Stachowiak

Frank Y Xu

Toshiki Ito

Fei Li

Keiko Chiba

Edward Brian Fletcher

Gary Doyle

Gerard M Schmid

James P DeYoung

Anshuman Cherala

Byung Jin Choi

Dwayne L LaBrake

Tomonori Otani

Isao Kawata

Kosta S Selinidis

Yuto Ito

Zhengmao Ye

James W Irving

Se-Hyuk Im

Masayuki Tanabe

Cynthia B Brooks

Yeshwanth Srinivasan

Shingo Ishida

Toshiaki Ando

James P De Young

Ilya L Rushkin

Kosta Selinidis

David J Lentz

Gary F Doyle

A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-reactive polymer; a molecular weight of the at least one non-reactive polymer can be at least 750 g/mol and not greater than 20,000 g/mol; an amount of the non-reactive polymer may be at least 10 wt % and not greater than 30 wt %; and a viscosity of the photocurable composition may be not greater than 110 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Photocurable composition including a non-reactive polymer

A superstrate can include a body, a first layer, and a second layer, wherein the first layer is disposed between the body and the second layer. Each of the first and second layers has a proximal surface and a distal surface opposite the proximal surface, wherein the body is closer to the proximal surface than to the distal surface. An Ra of the distal surface of the second layer is less than an Ra of the distal surface of the first layer. In a method of making the superstrate, the relatively high Ra of the distal surface of the first layer may be related to the process or equipment used in forming the first layer. The second layer can be formed using another superstrate, where the Ra of the distal surface of the second layer is substantially the same as the contact surface of the other superstrate.

Superstrate including a body and layers and methods of forming and using the same

A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

Curable composition, film forming method and article manufacturing method

A photocurable composition can comprise a polymerizable material, and a photoinitiator, wherein the polymerizable material can comprise at least one polymerizable monomer and at least one reactive polymer. The reactive polymer can have a carbon content of at least 75% based on the total weight of the reactive polymer; a molecular weight of the at least one reactive polymer can be at least 400 g/mol and not greater than 50,000 g/mol; an amount of the reactive polymer may be at least 5 wt %; and a viscosity of the photocurable composition may be not greater than 100 mPa s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Photocurable composition including a reactive polymer

A superstrate can comprise a superstrate blank and a coating overlying an outer surface of the superstrate blank. The superstrate blank can comprises a central region and a tapered edge region, wherein the tapered edge region has an average taper angle of not greater than 20 degrees relative to a length direction of the superstrate blank. In one embodiment, the coating of the superstrate can be applied by spin coating and may have an edge bead below a plane of the coating surface within the central region.

Superstrate and method of making it

A photocurable composition can comprise a polymerizable material, an organic ionic compound and a photoinitiator, wherein an amount of the organic ionic compound may be not greater than 1.5 wt %, the organic ionic compound comprises an organic cation, and a conductivity of the photocurable composition can be at least 20 μS/cm. The photocurable composition can have an improved drop spreading and merging of drops in comparison to the same composition but not including the organic ionic compound.

Photocurable composition comprising an organic ionic compound

A photocurable composition can comprise a polymerizable material and an initiator. The polymerizable material can include at least one first multi-functional monomer containing an allyloxymethyl methacrylate structure in an amount at least 5 wt % and not greater than 20 wt % based on the polymerizable material. The photocurable composition can be suitable for use in inkjet adaptive planarization and may be adapted to form cured layers having a glass transition temperature of at least 120° C.

Photocurable composition

A photocurable composition can comprise a polymerizable material, a fullerene or fullerene derivative in an amount of at least 0.2 wt % and not greater than 5.0 wt %, and a photoinitiator and may be adapted for AIP or NIL processing. A photo-cured layer made from the photocurable composition can have an improved thermal stability in comparison to a photo-cured layer made from the same photocurable composition except not containing a fullerene or fullerene derivative.

Photocurable composition comprising a fullerene

A photocurable composition can comprise a polymerizable material and an initiator. The polymerizable material can comprise at least one 1,3-benzoxazine monomer and at least one acrylate monomer, and may have a viscosity of not greater than 20 mPa·s. The photocurable composition can be suitable for use in inkjet adaptive planarization and is adapted to form cured layers having exceptional heat stability up to 320° C.

A photocurable composition can comprise a polymerizable material and at least one photoinitiator, wherein the polymerizable material comprises a multi-functional vinylbenzene monomer in an amount of at least 30 wt % based on the total weight of the polymerizable material and the at least one photoinitiator includes an oxime ester compound. The photocurable composition can be adapted that a UV shrinkage after forming a photo-cured layer at 23° C. is not greater than 4.0%; and that a thermal shrinkage after conducting a baking treatment of the photo-cured layer at 350° C. is not greater than 3.5%.

A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, Xbeing C-Csubstituted or unsubstituted alkyl, Xbeing CHor H, After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.

Curable composition

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one first polymerizable monomer having a structure of Formula (1): (R)—Ar—(R)(1), with Ar being one or more substituted or unsubstituted aromatic rings; Rbeing a structure covalently bonded to Ar including at least one acrylate group; x being 1-4; and Rbeing —CH═CHor —CCH=CHcovalently bonded to Ar; y being 1-4.

Photocurable composition with enhanced thermal stability

A method of coating a superstrate using a vacuum chuck containing ridges can comprise attaching the superstrate on the vacuum chuck; applying on the superstrate a liquid layer of a coating composition, the coating composition comprising a coating agent and a non-fluorinated solvent, wherein the non-fluorinated solvent has a boiling point of at least 165° C.; and solidifying the coating composition to form a solid coating layer. The material of the superstrate can have a thermal conductivity of not greater than 10 W/mK and the solid coating layer obtained after solidifying may comprise a smoothness value (SM) of not greater than 1%, the smoothness value being defined as SM=(C/C)×100%, with Cbeing a maximum roughness depth of the coating layer and Can average thickness of the coating layer over a length of 10 mm of the solid coating layer.

Method of coating a superstrate

A laminate can contain a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include an isocyanate group containing compound of formula (1): R—R—N═C═O (1), with Rbeing a functional group different than the isocyanate group, and Rbeing substituted or unsubstituted alkyl or aryl. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.

Laminate containing an adhesion promoter layer and method of making the laminate

In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N&#x2550;C&#x2550;O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

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Cedar Park, TX, United States of America

Weijun Liu