Dell Products Inc.

Emc IP Holding Company LLC

Weidong Zuo

Qingqiang Guo

Gemma Hui Chen

Haifang Zhai

Yuan Chen

Yujie Zhou

Mingming Zhang

Wenjin Seraph Xu

Joseph P King

Jie Yang

Peter A Kaltenbach

John Charles Donachy

Hao Zhou

Yuxin Chen

Brad Philip Collins

Amrita Sidhu Maguire

David Boudreau

Kevin Keller

Zhao Chen

Chen Zhao

Zhiwen Jiang

Quanqing Zhu

Harris Di

Regan Zhu

Libertad Paloma Escobar Carrizales

Xiaoliang Zhou

A radiator for use in a liquid cooling system may have an inlet for receiving coolant fluid, an outlet for expelling coolant fluid, a plurality of radiating fins fluidically coupled between the inlet and the outlet such that coolant fluid flowing through the radiating fins radiates heat proximate to air proximate to the radiating fins, and a coolant reserve tank fluidically coupled to the plurality of radiating fins and oriented relative to the plurality of radiating fins such that a largest dimension of the coolant reserve tank is generally parallel to a flow of coolant fluid through the plurality of radiating fins. The coolant reserve tank may be configured to store excess coolant fluid and deliver at least a portion of the excess coolant fluid to fluidic pathways of the radiator in response to a decrease in volume of coolant fluid within the liquid cooling system.

Radiator with top layer coolant tank

An information handling system bay accepts plural communication carriers having storage communication support, such as in compliance with OCP3.0. The communication carrier has a support structure to support processing components, such as a network interface controller coupled to a printed circuit board, and coupled within the bay by a latch having a member extending from one end to engage the bay housing and latching an opposite chamfered end with a pin coupled to a spring loaded button. A press on the button away from the latch releases the chamfered end from the pin so support structure member is free from the housing bay to remove the communication carrier.

Information handling system carrier

A device and systems for cooling hardware components is disclosed. The smart cold plate (CP) device includes a first inlet port for supplying a first coolant path, a second inlet port for supplying a second coolant path, and a valve for selectively controlling a flow of a coolant between the first and second inlet ports and an internal port, the internal port connecting the first and second inlet ports to a CP. The device also includes an external port connected to the CP for removing the coolant from the smart CP device and a connector through which power is supplied to the valve. Various cooling systems incorporating the smart CP device are disclosed.

Smart cold plate for redundant liquid cooling loops

A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.

Providing continuous cooling to a storage rack

An information handling system includes two or more heat-generating devices and a liquid-assisted air cooling (LAAC) assembly to cool at least some of the devices. The LAAC assembly includes a radiator, first and second pumps connected in series with the radiator. The LAAC assembly further includes first and second cold plates enclosing first and second CPUs or another suitable heat generating device. The first and second cold plates are connected in parallel between an inlet of the first pump and an outlet of the second pump. In this configuration, the serial connected pumps in combination with the parallel connected cold plates provide 1+1 pump redundancy while delivering cold coolant from the radiator outlet to both heat generating devices such that neither heat cold plate receives pre-heated coolant from the other cold plate.

Liquid-assisted air cooling design with parallel cold plates and serial pumps

A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1&#xd7;CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

Modular and highly available cooling distribution unit for information handling systems

An adaptive airflow flapper assembly may be configured to when present in a first chassis bay adjacent to a second chassis bay unpopulated with a another information handling resource module, close to a closed position relative to the enclosure such that, due to non-overlap of the enclosure airflow openings relative to the flapper airflow openings, the adaptive airflow flapper assembly prevents airflow between the interior and the exterior of an enclosure, and when present in the first chassis bay adjacent to the second chassis bay populated with the second information handling resource module, open to an open position relative to the enclosure to allow airflow between the interior and the exterior of the enclosure.

Systems and methods for sharing of airflow between adjacent information handling resource modules

Embodiments of the present disclosure provide a top cover arrangement for a storage and the corresponding storage. The storage comprises a drawer chassis which accommodates disks that are organized among a plurality of rows. The top cover arrangement covers the disks in a foldable manner and comprises: a substrate covering the disks and being flexible; and a plurality of folding parts mounted on the substrate and corresponding to the plurality of the rows; the folding parts being adapted to be at least partially folded to expose at least one row of disks in response to the disks being pulled out of the drawer chassis.

Top cover arrangement for a storage and the corresponding storage

Embodiments include expansion cards that provide a specialized capability, such as networking, when coupled to an Information Handling System (IHS). The expansion card embodiments include a printed circuit board (PCB) of a first width and a heat sink located on a top surface of the PCB. The expansion cards also include pins located on a distal end of the PCB, where the pins are received by a connector of the IHS. Embodiments include a button operable for ejecting a latch of the expansion card from a stored position in response to pressing the button. When ejected, the latch remains within the first width of the PCB, thus supporting high-density configurations of expansion cards. The ejected latch is further operable for an administrator to easily pull the expansion card from the IHS. Expansion card embodiments may also include vents that provide pathways for ventilating heated air away from the heat sink.

Hot-pluggable expansion card supporting high-density configurations

A storage device carrier system includes a linear array of mounting trays, wherein each mounting tray is configured to removeably receive a storage device. A velocity-increasing longitudinal cooling channel is configured to provide cooling air to the linear array of mounting trays.

Storage device carrier system

An apparatus comprises a memory, a processor coupled to the memory, one or more altitude sensors, one or more ambient temperature sensors, and one or more air movers. The processor implements an air mover control module configured to obtain at least one altitude reading from at least one of the one or more altitude sensors, to determine an altitude factor based on the at least one altitude reading, to obtain at least one ambient temperature reading from at least one of the one or more ambient temperature sensors, to determine target speeds for respective ones of the air movers utilizing the altitude factor and the at least one ambient temperature reading, and to control operation of the air movers based on the target speeds.

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Shrewsbury, MA, United States of America

Weidong Zuo