International Rectifier Corporation

Weidong Zhuang

Weiping Hu

David Scott Doiron

Michael McGonigle

A semiconductor package which includes a substrate formed from AlN and electrical terminals formed from tungsten on at least one surface of the substrate by bulk metallization to serve as electrical connection to a component within the package.

Hermetic surface mounted power package

A hermetically sealed semiconductor package that includes a power semiconductor die having electrodes thereof electrically connected to the external surface mountable terminals of the package without the use of wirebonds.

Hermetic semiconductor package

A sealed semiconductor power module that may include a rectifier, such as a silicon controlled rectifier (SCR), is provided. The module includes an AlN substrate having a bottom surface positioned on a metallic base plate and a top surface that includes a first pad and a second pad, the substrate including a copper body on both of the two major surfaces. The module also includes a first die and a second die positioned on top of the first and second pads, respectively, the first die and the second die each including a main contact area on a top surface thereof, the first die including an isolated gate area on the top surface to which is coupled a gate terminal; and first and second power terminals in direct wirebondless electrical connection via molybdenum tabs with the main contact areas of the die.

Hermetically sealed semiconductor device module

A power module includes a power switching device and a flexible circuit with first and second traces electrically connected to the switching device, the first and second traces serving as an input signal carrier and an output signal carrier for the switching device.

Use of flexible circuits in a power module for forming connections to power devices

A high reliability package which includes electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

Surface mountable hermetically sealed package

A high reliability power module which includes a plurality of hermetically sealed packages each having electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

High reliability power module

A module which includes a hermetically sealed housing and a terminal block which is integrated with the hermetically sealed housing to provide electrical connection to external devices.

Growing community of inventors

Worcester, MA, United States of America

Weidong Zhuang