Powerchip Semiconductor Corporation

Ememory Technology Inc.

Renesas Technology Corp.

Wei-Zhe Wong

Ching-Sung Yang

Chih-Chen Cho

Hsin-Ming Chen

Ching-Hsiang Hsu

Meng-Yi Wu

Shih-Jye Shen

Ming-Chou Ho

Pin-Yao Wang

Shih-Chan Huang

Ping-Lung Ho

Hsiang-Chung Chang

The invention provides a code generating apparatus and an OTP memory block. The code generating apparatus of present disclosure includes a plurality of first one time programming (OTP) memory cells, a reference signal provider and a sense amplifier. The first OTP memory cells are coupled to a first bit line. The reference signal provider provides a reference signal. Wherein, at least one of the first OTP memory cells provides a read current to the first bit line, and the sense amplifier compares the read current and the reference signal to generate an output code. A current value of the reference signal is set within a range, and the range is set by the bit current corresponding to a maximum bit count, such as that the output code is determined by a manufacturing variation of the at least one first OTP memory cell.

Code generating apparatus and one time programming block

An electronic device having anti-cloning function includes a first critical integrated circuit, which further includes a first security function block configured to authenticate an identity of a second critical integrated circuit in communication with the first critical integrated circuit, wherein the first security function block authenticates the identity of the second critical integrated circuit according to a chip identity of the second critical integrated circuit created using a non-volatile memory (NVM) physically unclonable function (PUF).

Electronic device with self-protection and anti-cloning capabilities and related method

A random number generator device has at least at least a memory unit, a voltage generator, and a control circuit. Each memory unit has two memory cells, one of the two memory cells is coupled to a bias line and a first bit line, and another of the two memory cells is coupled to the bias line and a second bit line. The voltage generator provides the two memory cells a bias voltage, a first bit line voltage and a second bit line voltage via the bias line, the first bit line and the second bit line respectively. The control circuit shorts the first bit line and the second bit line to program the two memory cells simultaneously during a programming period and generates a random number bit according the statuses of the two memory cells during a reading period.

Random number generator device and control method thereof

An antifuse-type OTP memory cell has following structures. A first doped region, a second doped region, a third doped region and a fourth doped region are formed in a well region. A gate oxide layer covers the surface of the well region. A first gate is formed on the gate oxide layer and spanned over the first doped region and the second doped region. The first gate is connected with a word line. A second gate is formed on the gate oxide layer and spanned over the second doped region and the third doped region. The second gate is connected with an antifuse control line. A third gate is formed on the gate oxide layer and spanned over the third doped region and the fourth doped region. The third gate is connected with an isolation control line.

Antifuse-type one time programming memory cell and array structure with same

A method for programming an antifuse-type OTP memory cell is provided. Firstly, a first program voltage is provided to a gate terminal of an antifuse transistor. A first bit line voltage is transmitted to the antifuse transistor. A first voltage stress with a first polarity is provided to a gate oxide layer of the antifuse transistor to form a weak path between the gate terminal and the first drain/source terminal of the antifuse transistor. Secondly, a second program voltage is provided to the gate terminal of the antifuse transistor. A second bit line voltage is transmitted to the antifuse transistor. A second voltage stress with a second polarity is provided to the gate oxide layer of the antifuse transistor. Consequently, a program current is generated along the weak path to rupture the gate oxide layer above the first drain/source terminal.

Method for programming antifuse-type one time programmable memory cell

An antifuse-type one time programming memory cell has following structures. A first doped region, a second doped region, a third doped region and a fourth doped region are formed in a well region. A gate oxide layer covers a surface of the well region. A first gate is formed on the gate oxide layer and spanned over the first doped region and the second doped region. The first gate is connected with a word line. A second gate is formed on the gate oxide layer and spanned over the third doped region and the fourth doped region. The second gate is connected with the word line. A third gate is formed on the gate oxide layer and spanned over the second doped region and the third doped region. The third gate is connected with an antifuse control line.

A memory cell includes a first select transistor, a first following gate transistor, an antifuse transistor, a second following gate transistor, and a second select transistor. The first select transistor has a first terminal coupled to a bit line, a second terminal, and a gate terminal coupled to a word line. The first following gate transistor has a first terminal coupled to the second terminal of the first select transistor, a second terminal, and a gate terminal coupled to a following control line. The antifuse transistor has a first terminal coupled to the second terminal of the first following gate, and a gate terminal coupled to an antifuse control line. The second following gate transistor and the second select transistor are disposed symmetrically to the first following gate transistor and the second select transistor with respect to the antifuse transistor.

One-time programmable memory array having small chip area

A one time programming memory cell includes a selecting circuit, a first antifuse storing circuit and a second antifuse storing circuit. The selecting circuit is connected with a bit line and a word line. The first antifuse storing circuit is connected between a first antifuse control line and the selecting circuit. The second antifuse storing circuit is connected between a second antifuse control line and the selecting circuit.

One time programming memory cell and memory array for physically unclonable function technology and associated random code generating method

A one time programmable (OTP) memory cell includes a select gate transistor, a following gate transistor, and an antifuse varactor. The select gate transistor has a first gate terminal, a first drain terminal and a first source terminal. The following gate transistor has a second gate terminal, a second drain terminal and a second source terminal coupled to the first drain terminal. The antifuse varactor has a third gate terminal, a third drain terminal, and a third source terminal coupled to the second drain terminal. The select gate transistor, the following gate transistor, and the antifuse varactor are formed on a substrate structure.

One-time programmable memory cell capable of reducing leakage current and preventing slow bit response, and method for programming a memory array comprising the same

The present invention provides a method of operating a one-time programmable read only memory (OTPROM). The OTPROM includes at least a select transistor, an electrode and a dielectric layer disposed on a substrate, wherein the electrode is set up on the source region of the select transistor and the dielectric layer is set up between the electrode and the source region. The method of operating the one-time programmable read only memory includes performing a programming operation to write a digital data value of '1' into the memory and performing a programming operation to write a digital data value of '0' into the memory.

Operating method of one-time programmable read only memory

A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.

Method of fabricating flash memory cell

A nonvolatile memory is provided. The memory includes a select transistor and a trench transistor. The select transistor is formed on the substrate. The select transistor includes a first gate formed on the substrate and first and second source/drain regions formed in the substrate next to the first gate. The trench transistor is formed in the substrate. The trench transistor includes a second gate formed in the trench of substrate, an electron trapping layer formed between the second gate and the trench and second and third source/drain regions formed in the substrate next to the second gate. The select transistor and the trench transistor share the second source/drain region.

Nonvolatile memory

A non-volatile memory device having a substrate, an n type well, a p type well, a control gate, a composite dielectric layer, a source region and a drain region is provided. A trench is formed in the substrate. The n type well is formed in the substrate. The p type well is formed in the substrate above the n type well. The junction of p type well and the n type well is higher than the bottom of the trench. The control gate which protruding the surface of substrate is formed on the sidewalls of the trench. The composite dielectric layer is formed between the control gate and the substrate. The composite dielectric layer includes a charge-trapping layer. The source region and the drain region are formed in the substrate of the bottom of the trench respectively next to the sides of the control gate.

Non-volatile memory device and manufacturing method and operating method thereof

A one-time programmable read only memory is provided. The memory includes a substrate, a select transistor, an electrode and a dielectric layer. The select transistor is formed on the substrate. The electrode is formed over the source region of the select transistor. The dielectric layer is formed between the electrode and the source region of the select transistor. Digital data is stored in the memory through the breakdown or not of the dielectric layer.

Growing community of inventors

Tainan, Taiwan

Wei-Zhe Wong