Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Wintek Corporation

Hong-yuan Technology Co., Ltd.

Industrial Technology Research Technology

Wei-Yuan Cheng

Kuo-Lung Lo

Shu-Wei Kuo

Jyh-Wen Shiu

Yun-Sheng Ku

Hsin-Hung Lee

Pei-Ju Su

Yu-Hsiang Tsai

Chen-Tsai Yang

Chung-Wei Wang

Chao-Kai Cheng

Wan-Wen Chiu

Kuo-Chang Lee

Shau-Fei Cheng

Chun-Yi Cheng

Jie-Mo Lin

Cheng-Hung Yu

Chih-Yuan Wang

Ming-Huan Yang

Tai-Jui Wang

Chien-Ting Chan

Hsi-Rong Han

Yuh-Zheng Lee

Chen-Chu Tsai

Yi-Chun Liu

Chieh-Wei Feng

Chieh-Yi Huang

Yen-Ting Wu

Jhih-Ping Lu

Jen-Chieh Yang

Wan-Jen Tsai

Cheng-Hsi Hsieh

Chih-Chun Hsiao

Min-Hsiung Liang

Chien-Hsun Chu

Hsing-Hua Wu

Ching-Yao Chen

Pei-Pei Cheng

Yu-Chao Wu

Yu-Jhen Yang

Yu-Sheng Huang

Chian-Fu Huang

Provided is a forming method of a redistribution structure including: forming a first redistribution layer and a first compensation circuit layer on a substrate, wherein the first compensation circuit layer surrounds the first redistribution layer, and the first compensation circuit layer and the first redistribution layer are electrically insulated from each other; forming a first dielectric layer on the first redistribution layer and the first compensation circuit layer; and forming a second redistribution layer and a second compensation circuit layer on the first dielectric layer, wherein the second compensation circuit layer surrounds the second redistribution layer, the second compensation circuit layer and the second redistribution layer are electrically insulated from each other, the second compensation circuit layer is connected to the first compensation circuit layer, and the second redistribution layer is connected to the first redistribution layer.

Redistribution structure and forming method thereof

A chip package structure including a redistribution structure layer, at least one chip, and an encapsulant is provided. The redistribution structure layer includes at least one redistribution circuit, at least one transistor electrically connected to the redistribution circuit, and a plurality of conductive vias electrically connected to the redistribution circuit and the transistor. The chip is disposed on the redistribution structure layer and electrically connected to the redistribution structure layer. The encapsulant is disposed on the redistribution structure layer and at least encapsulates the chip. A manufacturing method of a chip package structure is also provided.

Chip package structure and manufacturing method thereof

A multiplayer sports formation arrangement prompting method adapted to monitor, by a computing device, a formation of a plurality of athletes participating in a multiplayer sport to prompt each of the athletes to adjust a position is provided, in which at least two wind sensors and a positioning device are disposed on or around each of the athletes. In this method, relative positions of the athletes with respect to each other are detected by using the positioning device, a wind direction is detected by using the at least two wind sensors disposed on or around a first athlete of the athletes, a second athlete behind the first athlete is prompted to adjust the position to enter a low wind resistance zone according to the relative position of the first athlete with respect to the second athlete and the detected wind direction, and the second athlete is prompted to adjust a position within the low wind resistance zone based on values detected by the at least two wind sensors disposed on or around the second athlete.

Multiplayer sports formation arrangement prompting method and system

A package structure includes a redistribution layer, a chip, an encapsulant, an under bump supporting layer, an attachment layer and solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface and a patterned circuit layer disposed on the first surface, wherein an outer surface of the patterned circuit layer and the first surface are coplanar. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface to encapsulate the chip. The under bump supporting layer is disposed on the first surface and includes openings for exposing the outer surface. The attachment layer covers the inner surface of each opening and the exposed portion of the patterned circuit layer. The solder balls are disposed in the openings respectively and electrically connected to the patterned circuit layer.

Package structure and manufacturing method thereof

A package structure includes a redistribution layer, a chip, an encapsulant, a plurality of under ball release layers, and a plurality of solder balls. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a patterned circuit layer, wherein the patterned circuit layer includes a plurality of pads protruding from the first surface. The chip is disposed on the second surface and electrically connected to the patterned circuit layer. The encapsulant is disposed on the second surface and encapsulates the chip. The under ball release layers cover the pads respectively. The solder balls are disposed on the under ball release layers and electrically connected to the pads.

Package structure having under ball release layer and manufacturing method thereof

A semiconductor package structure includes a redistribution structure, a chip, an upper dielectric layer, a plurality of conductive members and an encapsulation layer. The redistribution structure includes a redistribution layer and a first dielectric layer disposed on the redistribution layer. The upper dielectric layer is disposed between the chip and the first dielectric layer of the redistribution structure, wherein the upper dielectric layer and the first dielectric layer are organic materials. A plurality of conductive members is disposed between the redistribution layer and the chip. Each conductive member has a first end adjacent to the chip and a second end adjacent to the redistribution structure, wherein the first end of said each conductive member contacts with the upper dielectric layer and the second end of said each conductive member contacts with the first dielectric layer.

Semiconductor package structure

A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.

Chip bonding apparatus, chip bonding method and a chip package structure

A redistribution layer structure of the semiconductor package includes a dielectric layer having a thickness, at least one upper conductive wire disposed on a first surface of the dielectric layer, at least one lower conductive wire disposed on a second surface of the dielectric layer, and vias penetrating the dielectric layer and connecting the at least one upper conductive wire and the at least one lower conductive wire. Each via has a cross-section at one upper conductive wire. The cross-section has a third width. The ratio of the third width to the thickness of the dielectric layer is less than or equal to 1. The ratio of the pitch between every two adjacent vias to the third width is greater than or equal to 0.5.

Redistribution layer structure of semiconductor package

According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Electronic device package, electronic device structure and method of fabricating electronic device package

A display device including a first substrate, a second substrate, a display element layer, a non-transparent structure, an optical guiding structure and a reflective layer is disclosed. The second substrate is disposed opposite to the first substrate adjacent to a display surface of the display device. The display element layer is disposed between the first and the second substrates. The non-transparent structure, located between the optical guiding structure and the display element layer, defines at least one opening of the display device. The optical guiding structure corresponds to the one opening. The optical guiding structure includes a plurality of insulating structures each having a first surface adjacent to the non-transparent structure and side surfaces connected to the first surface. The reflective layer is disposed on the side surfaces. The ambient light entering via the second substrate is reflected by the reflective layer and exists via the opening.

Display device

The disclosure provides an electro-wetting element, including: a first substrate and a second substrate, wherein the first substrate and the second substrate are disposed oppositely; a first electrode formed on the first substrate; a photoreactive layer formed on the first electrode, wherein the photoreactive layer includes a reversible photoreactive material; a second electrode formed on the first substrate or the second substrate; and a polar fluid and a non-polar fluid disposed between the first substrate and the second substrate.

Electro-wetting element and operation method thereof, electro-wetting display device

The disclosure provides an electrowetting display device. The electrowetting display device includes a first substrate and a second substrate disposed to each other. A first electrode layer may dispose on the first substrate. A second electrode layer may dispose on the second substrate. A hydrophobic dielectric layer is disposed on the first electrode layer. A first pixel rib is disposed on the first substrate. A second pixel rib is disposed on the first pixel rib. A water contact angle of the second pixel rib may be larger than that of the first pixel rib. A first liquid and a second liquid may be disposed in between the first substrate and the second substrate.

Electrowetting display device

An electrofluidic device includes first structural layer and second structural layer. First structural layer includes first substrate; and first electrode and second electrode on the first substrate. The second electrode has an indent region surrounding and without contacting first electrode. First hydrophobic layer is at least over the second electrode. Second structural layer at one side of the first structural layer with a gap includes second substrate and groove structure layer. The groove structure layer includes an indent groove, corresponding to the indent region of the second electrode. Second hydrophobic layer is over the groove structure layer. Polar fluid is disposed in the indent groove and remains in contact with the first electrode. Non-polar fluid is disposed in the gap between the first and second structural layers.

Electrofluidic device and operation method thereof

A display module is provided, which includes a first and a second substrates, a transparent type solar cell, a display device, an electric power storage device, a driving circuit and a power supply transfer switch. In the display module, the first substrate, the transparent type solar cell, the display device and the second substrate are successively arranged according to an incident direction of a light source. The transparent type solar cell has a visible light transmittance of 10%-40% and a color temperature (Tc) larger than 2400K. The electric power storage device is connected to the transparent type solar cell for storing electric power there from, and the driving circuit is connected to the display device for driving the same. The power supply transfer switch is used for transferring the electric power into the electric power storage device or the driving circuit.

Display module

Electrowetting display devices are presented. The electrowetting display includes a first substrate and an opposing second substrate with a transparent polar fluid layer and an opaque non-polar fluid layer insoluble with each other and interposed between the first and second substrates. A first transparent electrode is disposed on the first substrate. A second transparent electrode is disposed on the second substrate. A dielectric layer is disposed on the second transparent electrode. A reflective plate structure is interposed between the second transparent electrode and the second substrate, thereby defining a reflective region and a transmission region. A backlight plate is disposed on the back of the second substrate. During operation, the opaque non-polar fluid converges, therefore, exposing equal areas of reflective region and transmission region.

Electrowetting display devices with a reflective plate structure

Growing community of inventors

Taipei County, Taiwan

Wei-Yuan Cheng