Boe Technology Group Co., Ltd.

Honeywell International Inc.

Microsoft Technology Licensing, LLC

Google Inc.

United States of America As Represented by the Secretary of the Air Force

Beijing Boe Technology Development Co., Ltd.

Peking University

Beijing Baidu Netcom Science Technology Co., Ltd

Petrochina Company Limited

Beijing University of Posts and Telecommunications

Beijing Sensetime Technology Development Co., Ltd.

Beijing Goldwind Science & Creation Windpower Equipment Co., Ltd.

Xinjiang Goldwind Science & Technology Co., Ltd.

Chipone Technology (beijing) Co., Ltd.

Beijing Sankuai Online Technology Co., Ltd

Wei Yang

Ce Ning

Xinhong Lu

Alex Gu

Tianmin Zhou

Lizhong Wang

Ke Fei Wang

Hehe Hu

Yuandong Gu

Guangcai Yuan

Rui Huang

Ulrich Bonne

Steven J Eickhoff

Teresa M Marta

Wenlin Zhang

Burgess R Johnson

Adam Dewey McBrady

Chunbo Zhang

Yunping Di

Martin John Willett

Binbin Tong

Thomas E Nohava

Jong Moon Park

Xin Yang

Yingwei Liu

Liping Lei

J David Zook

Tariq Samad

Peter Tobias

Feng Hong

Qingrong Ren

Jianming Sun

Rodney Royston Watts

Subash Krishnankutty

Ran Bi

Scott A McPherson

Jipeng Song

Leonard Hilton

Haisheng Wang

Yingming Liu

Qiang Li

Xin Zhang

Zhanfeng Cao

Barrett E Cole

Xianqin Meng

Fuqiang Li

Fan Yang

Dongsheng Li

Robert E Higashi

Bernard S Fritz

Tao Yang

Aravind Padmanabhan

Seongyeol Yoo

Zhenyu Zhang

Pengxia Liang

Zheng Fang

Gang Chen

Guoqing Wang

Chenyang Zhang

Xiaogang Wang

Yang Zeng

Xiaohu Li

Yingjie Li

Lei Luo

Jing Hu

Muxin Di

Ke Wang

Jiahui Han

Liangjian Li

Jianjun Zhang

Jeffrey Michael Klein

Yu Lin

Zhen Zhang

Zhiyong Dai

Shihong Zou

Hongsheng Li

Matthew S Marcus

Zhaohui Qiang

Hao Wei

Chengfu Xu

Lei Fan

Woobong Lee

Wanli Ouyang

Weiting Peng

Jin Lai

Tong Wu

Li Qiang

Yawei Wang

Xiaming Zhu

Yan Qu

Yinian Mao

Qiuli Wang

Feng Deng

Paul Bryant Koeneman

Chunming Xiong

Gustav Errol Rustan

Yu Wen

Keyu Liu

Jingshang Zhou

Taotao Mu

The present disclosure provides methods and apparatuses for multi-screen management. In some implementations, a plurality of connection requests may be received from a plurality of screen devices respectively. A screen host unit corresponding to each screen device may be created. A connection of each screen host unit to a corresponding screen device may be established. Screen display data may be transmitted, by at least one screen host unit, to at least one corresponding screen device through at least one corresponding connection respectively. Moreover, in some implementations, a connection request may be transmitted to a screen management hub. A connection to a corresponding screen host unit created by the screen management hub may be established. Screen display data may be received from the screen host unit through the connection. The screen display data may be displayed.

Multi-screen management

An array substrate and a display panel, relating to the technical field of display. The array substrate includes a base substrate, and a thin film transistor group which is provided on one side of the base substrate and includes at least two thin film transistors, the thin film transistors being stacked in a direction perpendicular to the base substrate.

Array substrate and display panel

An organic light emitting diode display device are provided. The organic light emitting diode display device includes: a substrate; a barrier layer, located on a side of the substrate; a first buffer layer, located on a side of the barrier layer; a first semiconductor layer, located on a side of the first buffer layer; a first gate insulating layer, located on a side of the first semiconductor layer; a first gate electrode, located on a side of the first gate insulating layer; a second buffer layer, located on a side of the first gate electrode; a second semiconductor layer, located on a side of the second buffer layer; a second gate insulating layer, located on a side of the second semiconductor layer; a second gate electrode, located on a side of the second gate insulating layer.

Organic light emitting diode display device

The present application provides an array substrate, a manufacturing method for the same, and a display panel. The array substrate includes a display area and a non-display area connected to the display area, and the display area includes a plurality of sub-pixels arranged in an array. The non-display area includes at least one polysilicon transistor, each of the sub-pixels includes an oxide transistor and a pixel electrode. A gate of the oxide transistor as well as a first electrode and a second electrode of the polysilicon transistor are arranged in a same layer; an active layer of the oxide transistor and the pixel electrode are arranged in a same layer, and are in contact with each other. The active layer of the oxide transistor includes an oxide semiconductor material, and the pixel electrode includes an oxide conductor material.

Array substrate and manufacturing method for the same, display panel

A color filter, a preparation method therefore, an array substrate and a display device are provided. The color filter includes a plurality of filter units () provided on a base substrate () for transmitting light of different colors, and a light shielding layer () located between adjacent filter units () for transmitting light of different colors. The filter unit () includes a first surface facing the base substrate (), a second surface facing away from the base substrate, and a third surface connecting the first surface and the second surface. The light shielding layer () is provided on the third surface of at least one of two adjacent filter units () transmitting light of different colors.

Color filter and preparation method therefor, array substrate and display device

The present application discloses a drive backplane and a preparation method thereof, a display panel, and a display device. The drive backplane includes a flexible substrate provided with a first via hole; a first passivation layer located on a side of the flexible substrate and provided with a second via hole, an orthographic projection of the second via hole being at least partially overlapped with an orthographic projection of the first via hole; a thin film transistor located on a side, facing away from the flexible substrate, of the first passivation layer; and an electrical connecting structure, including a signal trace and a connecting terminal.

Drive backplane and preparation method thereof, display panel, and display device

A method for determining multimedia editing information includes: obtaining a first playback time of a first target frame in first multimedia data to be edited, a second playback time of the first target frame for second multimedia data after editing and a playback multi-times speed set for the first multimedia data; determining, based on the first playback time and the second playback time, a time deviation that occurs while editing the first multimedia data at the playback multi-times speed for the first multimedia data; and determining, based on the time deviation, the first playback time, the second playback time and the playback multi-times speed, a playback time of the first multimedia data corresponding to each playback time of the second multimedia data after the second playback time.

Method and apparatus for determining multimedia editing information, device and storage medium

An unmanned device control method and apparatus, a storage medium, and an electronic device. An unmanned device is controlled to move according to a preplanned target path; current environment information of the unmanned device is obtained; according to the current environment information of the unmanned device, a target subpath on which the unmanned device is located is determined, from target subpaths included in the target path, as a designated subpath; and a control strategy is then determined according to a scenario type corresponding to the designated subpath, and a determined control strategy is used to control the unmanned device.

Unmanned device control method and apparatus, storage medium, and electronic device

A displaying base plate and a manufacturing method thereof, and a displaying device. The displaying base plate includes a substrate, and a first electrode layer disposed on one side of the substrate, wherein the first electrode layer includes a first electrode pattern; a first planarization layer disposed on one side of the first electrode layer that is away from the substrate, wherein the first planarization layer is provided with a through hole, and the through hole penetrates the first planarization layer, to expose the first electrode pattern; and a second electrode layer, a second planarization layer and a third electrode layer that are disposed in stack on one side of the first planarization layer that is away from the substrate, wherein the second electrode layer is disposed closer to the substrate, the second electrode layer is connected to the first electrode pattern and the third electrode layer.

Displaying base plate and manufacturing method thereof, and displaying device

An OLED display device including a display area is provided. A first and second thin film transistors (TFTs) are arranged in the display area, the first TFT includes a first active layer, the second TFT includes a second active layer, a material of the first active layer is different from that of the second active layer. The OLED display device includes a substrate, the second active layer, a second gate of the second TFT, the first active layer, a first gate of the first TFT, a first source and drain of the first TFT, a second source and drain of the second TFT, a first data line in a same layer as the second source and drain, a first planarization layer on the first data line, and a second data line on the first planarization layer and electrically insulated from the first data line.

Method of fabricating array substrate, array substrate and display device

The present disclosure relates to an OLED display panel and display device. The OLED display panel includes: a display area, a bending area and a bonding area for bonding a circuit board, wherein the display panel further includes: a base substrate; a first semiconductor pattern on the base substrate; a first insulating layer group on the first semiconductor pattern; a second semiconductor pattern on the first insulating layer group; a second insulating layer group on the second semiconductor pattern; first via holes in the first insulating layer group and the second insulating layer group; second via holes in the second insulating layer group, wherein the display panel further includes: a first groove located in the bending area and having a depth substantially identical to that of the first via holes; and a metal trace, connecting a trace in the display area to the circuit board.

OLED display panel and display device

The present disclosure provides an array substrate, an electronic device and a manufacturing method of the array substrate. The array substrate includes a base substrate, and a first transistor and a second transistor on the base substrate, a first electrode of the first transistor being connected to a second electrode of the second transistor; the array substrate further includes a photodiode including a first electrode, a second electrode, and a photosensitive layer between the first electrode and the second electrode, and the first electrode is electrically connected to a gate of the first transistor. In the arrangement, the first transistor and the second transistor are connected in series to form one control unit, and the uniformity and stability of the control unit are greatly improved.

Array substrate with light shielding, electronic device and manufacturing method of array substrate with light shielding

A buffer apparatus, a chip and an electronic device. The apparatus comprises: a voltage adjustment module () comprising a first P-type metal-oxide-semiconductor field-effect transistor (PMOS), wherein the voltage adjustment module () is used for receiving an input voltage, using a threshold voltage for the first PMOS to adjust the input voltage, and outputting a driving voltage; and a buffer module () electrically connected to the voltage adjustment module () and used for receiving an input signal, buffering the input signal under the driving voltage, and outputting a buffered signal. The driving voltage obtained by using the threshold voltage for the first PMOS to adjust the input voltage can compensate for a process corner of the buffer module (), such that the range of a flip point voltage of the buffer module () becomes small and meets process requirements.

Buffer apparatus, chip and electronic device

Growing community of inventors

Beijing, China

Wei Yang