Shenzhen Sunlord Electronics Co., Ltd.

Shenzhen Sireda Technology Co., Ltd

Wei Xie

Hui Lin

Xiaohu Tang

Deping Zeng

Qunsheng Zhou

Guohua Wang

Yongming He

A surface-mounted transformer includes an adhesive layer and a winding product. The winding product is disposed inside the adhesive layer; the winding product includes an I-shaped magnetic core and a coil wound on a middle pillar of the I-shaped magnetic core; leading-out ends of the coil are connected to electrodes; the electrodes are exposed on the surface of the adhesive layer; and the adhesive layer is obtained through compression molding forming of a magnetic molding material. Compared with a surface-mounted transformer in the prior art, which has equal performance indexes, the surface-mounted transformer has a smaller size with a decrease proportion of over 50%; and a BOBBIN and an insulating rubber tape do not need to be used in processing. The winding product in the surface-mounted transformer is completely covered by the adhesive layer, so that the product is high in reliability and can support a PSIP plastic package environment.

Surface-mounted transformer and processing method thereof

An IC test device includes a test circuit board and a test fixture. The fixture includes an interposer, a test socket, and a fastener. A protrusion is formed at a bottom face of the interposer, and a space is formed besides the protrusion. A plurality of first contacts is formed at the bottom of the protrusion for soldering with corresponding pads of the test circuit board. A plurality of second contacts is formed on a top face of the interposer and electrically connected to the first contacts. The socket defines a guide groove for receiving an IC. A plurality of conductors are arranged corresponding to the guide groove and extend through the test socket. Each conductor has a bottom end electrically connected to one corresponding second contact and a top end for contacting a pin of the IC. The fastener is mounted on the test socket to press the IC.

Test fixture and test device for IC

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Guangdong, China

Wei Xie