Checkpoint Systems, Inc.

Shanghai Jiaotong University

Wilmar (shanghai) Biotechnology Research & Development Center Co., Ltd.

Semiconductor Manufacturing (shanghai) International Corporation

Semiconductor Manufacturing (beijing) International Corporation

Shanghai Institute of Pharmaceutical Industry

Nio Co., Ltd.

Donghua University

Shanghai Modern Pharmaceutical Co., Ltd.

Shanghai Superconductor Technology Co., Ltd.

Supermag Technology (shanghai) Ltd.

Wei Wu

Gary Thomas Mazoki

Yong Qiao

Anthony F Piccoli

Thomas J McKeown

Seth Strauser

Yue Zhao

Lawrence C Appalucci

James Brodzik

Qiwen Niu

Yue Wu

Zhijian Jin

Haisheng Cao

Xiaojun Dai

Chunjiang Guo

Jiamin Zhu

Ying Liu

Yi Chen Zhong

Hong Xu

Quanhai Liu

Guoping Wang

Morui Li

Minyu Liu

Xuejun Wu

Yaoji Xuan

Guangyin Yuan

Zhiping Mao

Jian Hou

Sikan Chen

Shuai Zhao

Lin Yao

Xiaofeng Sui

Linping Zhang

Sha Liu

Guangyu Jiang

Chunsheng Cheng

Li Lu

Haiyan Sun

Chungang Li

Qihua Zhang

Jieping Guo

Gary Denton

Chenxin Chen

Sitian Gu

Migliavacca Francesco

Jiancheng Zhang

Donghong Wu

Yueyi Bao

Yijun Ding

Yamin Dai

Chenbo Zhang

Hui Lu

Jianghong Wan

Meifeng Zhou

Wenhai Lu

Provided is amutant strain for expressing an exogenous gene. Specifically, provided is amutant strain comprising, with respect tomutant strain GS115 or CICC32806, one or more of the following six mutations: BQ9382_C1-2260, EKK deletions at positions 308-310, a hypothetical protein; BQ9382_C1-3800, E129K, 60S ribosomal subunit assembly/exported protein LOC1; BQ9382_C1-5700, 1312M, mitochondrial external NADH dehydrogenase, type II NAD(P)H: quinone oxidoreductase; BQ9382_C2-3950, Q145X, an essential protein having a binding partner Psr1p and used for completely activating a general stress response; BQ9382_C3-2220, E188K, a hypothetical protein; and BQ9382_C3-4370, W196X, orotidine 5\'-phosphate decarboxylase. The providedmutant strain is an effective commonly employed host for exogenous expression, and can efficiently express different proteins, especially phospholipase and lipase.

mutant strain for expressing exogenous gene

A non-destructive measurement method and apparatus for the turn-to-turn resistivity distribution (TTRD) in non-insulation (NI) superconducting coils. The method includes: during the discharging or charging process, obtaining experimental values of voltage varying over preset time at different positions of the test coil; dividing the test coil into a plurality of measurement units and obtaining basic circuit elements; then constructing a preset equivalent circuit model including the basic circuit elements; based on the constructed equivalent circuit model, obtaining the first simulated values of voltage varying over preset time at different positions of the test coil; finally, determining the TTRD of the test coil based on the fitness value between experimental values and the first simulated values. When there is high fitness value between the first simulated values and experimental values, the TTRD corresponding to the first simulated values is considered as the TTRD within the test coil.

Non-destructive measurement method and apparatus for the turn-to-turn resistivity distribution in non-insulation superconducting coils

A digital control method is to accurately calculate the real-time addition amount of each dye in the solution replenishment system in the whole dyeing process based on the initial dyeing rate of each dye, and replenish the dye solution according to the real-time addition amount. A digital control system includes an automatic calculation Kvalue unit, a central processing unit and a replenishment pump. The automatic calculation Kvalue unit is composed of a dye solution concentration detection instrument, a sensor I and a BP neural network model. The BP neural network model is a BP neural network trained by a dye database. The automatic calculation Kvalue unit transmits the Kvalue to the central processing unit, calculates the replenishment amount through the central processing unit, and controls the replenishment pump to replenish the solution.

Digital control method and system thereof for solution replenishment system in the pad dyeing process with combination dyes

A method for fabricating a lamination structure of a second-generation high-temperature superconducting (2G-HTS) tape is provided. Suitable lamination tapes are selected and subjected to local oxidation on side to form a locally oxidized region having a target pattern. The lamination tapes and a to-be-laminated 2G-HTS tape are sequentially arranged, where the locally-oxidized side of each of the lamination tapes faces toward the 2G-HTS tape. The lamination tapes and the to-be-laminated 2G-HTS tape are simultaneously immersed in a molten solder pool, and subjected to reel-to-reel squeezing lamination to form the desired lamination structure. A lamination structure fabricated by the method is also provided.

Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the same

A second-generation high temperature superconducting (HTS) strip and a preparation method thereof are provided. The second-generation HTS strip includes a superconducting strip body and a stabilizing layer arranged thereon. The stabilizing layer is a copper-graphene composite film with a total thickness of 2-30 microns on one side. The superconducting strip may be obtained by the preparation method of: (1) putting a superconducting strip body into a magnetron sputtering reaction chamber, followed by pumping to a high-level vacuum and filling with a working gas; (2) using copper and graphene as targets, and performing a sputter coating by controlling a magnetron sputtering power, to deposit the targets onto at least one surface of the superconducting strip body. The prepared HTS strips containing copper-graphene stabilizing layer with high strength and high conductivity may have 30%-70% higher tensile strength than conventional copper plated superconducting strips, with less than 10% IACS attenuation in conductivity.

Second-generation HTS strip and preparation method thereof

A method for fabricating a second generation high-temperature superconductor (2G-HTS) tape, including: (S1) depositing a superconducting thin film on a surface of a ductile metal substrate with a buffer layer; (S2) forming a micro-holes array pattern on a surface of the superconducting thin film by etching using a reel-to-reel dynamic femtosecond infrared laser etching system, where the micro-holes array pattern covers the superconducting thin film; (S3) depositing a superconducting thick film on the surface of the superconducting thin film; and (S4) depositing a silver protective layer and a copper stabilization layer on a surface of the superconducting thick film.

Second generation high-temperature superconducting (2G-HTS) tape and fabrication method thereof

According to the present disclosure, on the basis of all existing mutations, the tenth glycine of a BC-PC-PLC is mutated into aspartic acid, a specific enzyme activity thereof is 83% higher than that of a sequence before the mutation, and protein expression and degumming activity of unit enzyme activity do not change, so as to further reduce manufacturing costs.

Phospholipase C and encoding gene thereof

The present disclosure teaches a photolithography plate and a mask correction method, and relates to the field of semiconductor technologies. In forms of the mask correction method, a patterned mask is formed on a substrate, a location of a scattering bar embedded in the substrate is determined according to the mask, and an opening is formed at the determined location so as to embed the scattering bar in the opening. A scattering bar is embedded in a substrate of a photolithography plate so as to effectively avoid the impact of the scattering bar on a mask pattern, reduce a deposition loss, improve the correction effect, and shorten a correction time.

Photolithography plate and mask correction method

Provided is a mutant of the wild type phosphatidylcholine-specific phospholipase C of. The mutations involved comprise the amino acid residue at position 63 being mutated from asparagine to aspartic acid, the amino acid residue at position 131 being mutated from asparagine to serine, and the amino acid residue at position 134 being mutated from asparagine to aspartic acid, and may comprise the amino acid residue at position 56 being mutated from tyrosine to alanine, lysine, asparagine, glutamine, histidine or tryptophan, and further, may also comprise the amino acid residue at position 106 being mutated from methionine to valine. Also provided are a polynucleotide molecule encoding the mutant, a nucleic acid construct and a host cell comprising the polynucleotide molecule, a composition comprising the mutant, and the use of the mutant, the polynucleotide molecule, the nucleic acid construct and the host cell.

Efficient phospholipase C mutant that does not rely on zinc ions

The application belongs to the technical field of automobile plated part, and in particular relates to an automobile, an automobile plated part, an automobile plated part mold and a manufacturing method thereof. The method for manufacturing automobile plated part mold comprises the steps of: establishing a first simulation model of the automobile plated part mold based on a set shape of the substrate of the automobile plated part; using the first simulation model to simulate injection process of the substrate to obtain a first simulation substrate; performing at least one modification processing on the first simulation model, so that a second simulation model thus obtained satisfies the following requirements: using the second simulation model to simulate the injection process of the substrate to obtain a second simulation substrate conforming to the set shape; manufacturing the automobile plated mold according to the second simulation model.

Automobile, automobile plated part, automobile plated part mold and manufacturing method thereof

A biodegradable metallic vascular stent includes: a base body which is tubular with a lumen along a longitudinal axis, wherein the base body has a plurality of circumferential support structures which are successively positioned along the longitudinal axis. The circumferential support structures are each composed of a sequence of repeat units and has two or more connectors, wherein two adjacent circumferential support structures are joined together by at least one of the connectors, and each of the connectors is attached to one of arched elements in the repeat units of the two adjacent circumferential support structures to be connected. The biodegradable metallic vascular stent possesses suited radial pressure, flexibility and fatigue strength. Furthermore, the stent is design for peripheral vascular disease and coronary artery disease treatment as well.

Biodegradable metallic vascular stent and application thereof

Security tag

A security tag may include a pin cover, a pin housing, a receiving gap disposed between the pin cover and the pin housing, a pin configured to engage an article placed within the receiving gap, and a biasing member configured to actuate the pin by urging the pin toward the pin cover in response to the article being substantially placed within the receiving gap.

Integrated lock and pin security tag

A solid housing tag and method to form the solid housing tag, the method including for example, an injection molding process. The solid housing tag has a single, continuous housing of which at least partially surrounds one or more various tag components arranged about a frame. The tag components may include a lock component and/or security component. The security component may include EAS elements, such as AM, EM, and/or RF technology elements; RFID elements; and/or benefit denial type elements.

Solid housing tag

A technology clip and method for supplementing a security tag with the technology clip for application to a product. The technology clip includes a technology element providing for an additional security and/or an identification feature when coupled to a tag, thus enhancing features of the security tag. The technology clip attaches about the tag and remains secured to the tag for when the tag is affixed to merchandise.

Technology enhancement clip for hard tags

Growing community of inventors

Shanghai, China

Wei Wu