Other

Cabot Microelectronics Corporation

Videojet Technologies Inc.

Uchicago Argonne, LLC

Wei Weng

Steven Grumbine

Zhengcheng Zhang

Linfang Zhu

Fengfei Xiao

Godwin Deng

Jeffrey Dysard

Lin Fu

Alexei Leonov

Nasim Azimi

Lei Liu

This specification discloses non-aqueous solvent, pigmented ink formulations that are suitable for the electronic and aerospace industries and form printed marks that are resistant to smearing and dissolution by organic solvents commonly used in overcoatings in this industry and others. These ink formulations are based on use of an acidic resin with an inherent acid value of at least about 25 mg KOH/g, preferably at least partially neutralized by a quaternary ammonium hydroxide and/or alcohol amine acid neutralizing or modifying agent.

Pigmented inkjet ink with high acid number acrylic resin

Embodiments of the invention relate to ink compositions suitable for applications in the printing industry, for example continuous inkjet printing, including ultra-high speed continuous inkjet printing. The ink compositions use volatile organic solvents, a colorant, and one or more binder resins including a resin that is a phenolic resole resin, wherein the ink composition is free of methanol, halogens, halogenated compounds and bisphenol-A. A phenolic resole resin of the ink composition preferably contains less than 0.1% by weight of free formaldehyde. The one or more binder resins including the phenolic resole resin may be present in an amount that is from about 5% to about 30% by weight of the ink composition.

Continuous inkjet ink composition

A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.

Copper barrier chemical-mechanical polishing composition

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Naperville, IL, United States of America

Wei Weng