Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Wei-Wen Tsai

Katsumasa Kawabata

Hui Bin Huang

Yosuke Takei

Akane Uehara

The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientation. The lower and upper sections are offset in a horizontal direction. Middle-sized pores with a columnar shape and a vertical orientation originate adjacent the middle sections and small pores with a columnar shape and a vertical orientation originate between the middle-sized pores. The pores combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.

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Philadelphia, PA, United States of America

Wei-Wen Tsai