China Wafer Level Csp Co., Ltd.

China Wafer Level Csp Ltd.

Faraday Technology Corporation

Elo Touch Solutions, Inc.

Topconn Electronic (kunshan) Co., Ltd.

Pixart Imaging Incorporated

Gemtek Technology Co., Ltd.

Black Decker Inc.

Epistar Corporation

Steering Solutions IP Holding Corporation

Suzhou Luxshare Technology Co., Ltd.

Suzhou Suzhen Bioengineering Co., Ltd

Robert Boschgmbh

Wei Wang

Zhiqi Wang

Qiong Yu

Guoqing Yu

Chung-Nan Pao

David Noppenberger

Sun-Yu Chou

Xiao-Dong Fei

Junjie Li

Qinqin Xu

Youjun Wang

Xingdong Zhao

Qiuhong Zou

Hui Calvin Yang

Chi Shen

Hui Hsuan Chen

Ying Yang

Qingwei Wang

Zhi-Qi Wang

Wenbin Wang

Chen Ou

Yun Zhang

Chi Hsiu Lee

Yu-Feng Ke

Song-Rong Han

Chia-Meng Chen

San-Yueh Huang

XingHua Sun

Chung-Chiu Lai

Wei Ji

Wen Ge

Mingda Shao

Hanyu Li

Juanjuan Qian

Xiaohua Huang

Juan Ding

Guoping Yu

Quihong Zou

Kuo Hsiung Li

Yi Lin Guo

Hung Chih Yang

Shenbing Wen

Ji An Luo

Yihong Wu

Chi Hung Wu

Hongbing Zhang

Guozhu Shi

Zheng-Xiang Wang

Hui Yang

Bin Liu

Jui Cheng Chuang

Electronic device

Disclosed is a cavity filter including a housing, and a first sheet-shaped resonant rod, a second sheet-shaped resonant rod, and a third sheet-shaped resonant rod disposed in the housing. The first sheet-shaped resonant rod includes a first upright section and a first extension section extending from one side of the first upright section. The second sheet-shaped resonant rod includes a second upright section and a second extension section extending from one side of the second upright section. The second upright section, the first upright section, and the third sheet-shaped resonant rod are connected to the housing, and the first extension section and the second extension section extend toward each other. Capacitive coupling is formed between the first and second sheet-shaped resonant rods. Capacitive coupling or inductive coupling is formed between the second and third sheet-shaped resonant rods and between the first and third sheet-shaped resonant rods.

Cavity filter

The present disclosure relates to the technical field of vehicle steering, and provides an electrically adjustable steering column and an electric power steering system. The electrically adjustable steering column includes: a telescopic component including a first steering shaft and a first protective jacket sleeved on the first steering shaft; a drive component including a drive bracket disposed on an outer wall of the first protective jacket, wherein a main body of the drive bracket is provided with a first energy absorption slot extending in an axial direction; an energy absorption component including a first bolt passing through the first energy absorption slot and extending into the first protective jacket, wherein the first bolt is fixedly connected to the first protective jacket and in a sliding fit with the first energy absorption slot; when in a use stage, the first bolt is maintained at a head end of the first energy absorption slot, and the drive component is capable of driving the telescopic component to expand and contract through the drive bracket; when in a collapse and energy absorption stage, the telescopic component collapses and drives at least the first bolt to slide in the first energy absorption slot. The present disclosure realizes a maintaining function during telescopic adjustment and an energy absorbing function during collision and collapse mainly by the bolt, thereby simplifying the structure and reducing the cost.

Electrically adjustable steering column and electric power steering system

A method for extracting polyol from a fermentation process is disclosed. The preparing method includes rectifying and purifying PDO (1,3-propanediol) from a polyol fermentation broth after concentration to form a steam condensate, wherein the concentration is a evaporative dehydration; and filtering the steam condensate through a reverse osmosis membrane to form a concentrated solution, wherein the retentate of the reverse osmosis flows back to the evaporative dehydration, and the penetrant of the reverse osmosis can be reused as a fermentation ingredient, as cleaning water or for sewage treatment; and the water content of the concentrated solution after the evaporative dehydration is 5-25 wt %; and the yield of PDO is 99.5%. The preparing method meets the requirements of water resources recycling, reduces the production loss of PDO and BDO (2,3-butanediol) during the concentration, and greatly cuts down on the amount of wastewater.

Method for extracting polyol from a fermentation process

A comparing circuit and a comparing module with hysteresis are provided. The comparing module includes a first resistor, a second resistor, and the comparing circuit, which are electrically connected to each other. A comparison voltage is determined according to an input voltage and the resistances of the first resistor and the second resistor. The comparing circuit includes an input circuit, an eternal circuit, and a coupling module. The coupling module includes a first coupling transistor, a second coupling transistor, a third transistor, and a fourth coupling resistor. Control terminals of the first coupling transistor and the second coupling transistor are selectively electrically connected to either one of a first terminal and a second terminal. The second terminals of the third coupling transistor and the fourth coupling transistor are selectively electrically connected to either one of the first terminal and the second terminal.

Comparing circuit and comparing module with hysteresis

A power switching circuit receives a first power, a second power and a switching signal, and generates an output power. The power switching circuit includes a first power path and a second power path. The first power path is connected with the first power. The second power path is connected with the second power. When the switching signal in a logic high level, the first power path is in a conducting state and the second power path is in a non-conducting state. Consequently, the first power is selected as the output power by the power switching circuit. When the switching signal in a logic low level, the first power path is in the non-conducting state and the second power path is in the conducting state. Consequently, the second power is selected as the output power by the power switching circuit.

Power switching circuit

A method for forming an image sensor package and an image sensor package are provided. The method includes: providing a first substrate and a second substrate which includes a first surface and a second surface opposite to the first surface, and attaching either surface of the first substrate with the first surface of the second substrate with an adhesive layer; forming a groove at the second surface of the second substrate; providing a base which includes a first surface and a second surface opposite to the first surface, where the first surface of the base is provided with a sensing region and multiple contact pads; and attaching the second surface of the second substrate with the first surface of the base, where a cavity is formed between the groove and the base, and the sensing region is located within the cavity.

Packaging method and packaging structure

Circular saw

A packaging method and a packaging structure are provided. The method includes: providing a first substrate and a second substrate, the second substrate having a fist surface and a second surface opposite to each other, a side surface of the first substrate being adhered to the first surface of the second substrate via an adhesive layer; forming a groove structure on the second surface of the second substrate; providing a base, the base having a first surface and a second surface opposite to each other, the first surface of the base including a sensing region and multiple bonding pads around the sensing region; and laminating the second surface of the second substrate with the first surface of the base to form a cavity between the groove structure and the base, such that the sensing region is located in the cavity.

Chip packaging method and chip packaging structure

The disclosure provides a voltage generating device and a calibrating method thereof. The voltage generating device includes a bandgap circuit, a regulator circuit and a calibrating circuit. The bandgap circuit provides a bandgap voltage. The regulator circuit generates an output voltage correspondingly according to the bandgap voltage. In a first stage of a calibration period, the calibrating circuit detects the bandgap voltage, and correspondingly sets a resistance of at least one resistor of the bandgap circuit according to the bandgap voltage. In a second stage of the calibration period, the calibrating circuit detects the output voltage, and correspondingly sets a resistance of at least one resistor of the regulator circuit according to the output voltage.

Voltage generating device and calibrating method thereof

A fingerprint recognition chip packaging structure and a packaging method. The packaging structure includes: a substrate provided with a substrate surface; a sensor chip coupled on the surface of the substrate, where the sensor chip is provided with a first surface and a second surface opposite the first surface, the first surface of the sensor chip is provided with a sensing area, and the second surface of the sensor chip is arranged on the surface of the substrate; a capping layer arranged on the surface of the sensing area of the sensor chip, where the material of the capping layer is a polymer; and, a lamination layer arranged on the surface of the substrate and that of the sensor chip, where the lamination layer exposes the capping layer. The packaging structure allows for reduced requirements on the sensitivity of the sensor chip, thus broadening applications.

Fingerprint recognition chip packaging structure and packaging method

A chip package structure and packaging method are provided. The chip package structure includes a sensing chip, a covering layer located on the first surface of the sensing chip, and a plug structure located in the sensing chip. The sensing chip includes a first surface, a second surface opposite to the first surface, and a sensing area located on the first surface. The second surface of the sensing chip faces to a base plate. One end of the plug structure is electrically connected to the sensing area, and the other end of the plug structure is exposed by the second surface of the sensing chip.

Wafer-level chip package structure and packaging method

A fingerprint recognition chip packaging structure and a packaging method. The packaging structure includes: a substrate, which is provided with a substrate surface; a sensor chip coupled on the surface of the substrate, where the sensor chip is provided with a first surface and a second surface opposite the first surface, the first surface of the sensor chip is provided with a sensing area, and the second surface of the sensor chip is arranged on the surface of the substrate; and, a lamination layer arranged on the surface of the substrate and on the surface of the sensor chip, where the lamination layer covers the surface of the sensing area of the sensor chip, a portion of the lamination layer located at the surface of the sensing area is of a preset thickness, and the material of the lamination layer is a polymer.

Growing community of inventors

Suzhou, China

Wei Wang